Advancements in PCB Lamination Process

The field of electronic technology is rapidly advancing, leading to continuous improvements in printed circuit technology. Multi-layer PCB boards have become increasingly popular, with their performance focusing on precision, density, fine details, and various sizes. The lamination process plays a vital role in manufacturing multi-layer boards, emphasizing the need for quality control.

Key Recommendations for Multi-layer Board Lamination

• Designing Inner Core Boards:
• 1. Select core board thickness based on total board thickness to ensure uniformity.
• 2. Maintain adequate spacing between core board dimensions and the effective unit.
• 3. Incorporate positioning holes to minimize layer deviation.
• 4. Ensure inner core boards are free of defects like openings, shorts, and oxidation.

As laminating machine technology advances, the design of inner core boards before lamination is critical. Factors such as thickness, spacing, positioning holes, and board cleanliness significantly impact the lamination quality. Following these recommendations can enhance the overall quality of multi-layer board lamination.