1. In the PCBA packaging process, the initial stage of wave soldering holds paramount importance in ensuring quality control throughout. With meticulous attention to this preparatory phase, subsequent steps involving temperature regulation, conveyor speed, and angle control can reliably maintain the quality of the PCBA wave soldering.
2. The Wave Soldering Process for Single Machine Type
3. Firstly, the component leads are formed, and the printed board is pasted with solder resist tape.
4. Secondly, components are inserted.
5. Thirdly, the printed board is placed into the welding fixture.
6. Fourthly, flux is applied.
7. Next, preheating occurs.
8. Subsequently, wave soldering takes place.
9. Cooling follows as the seventh step.
10. The printed board is then removed.
11. Solder resist tape is peeled off as the ninth step.
12. Inspection is conducted as the tenth step.
13. Xin L welding is performed as the eleventh step.
14. Cleaning ensues as the twelfth step.
15. Another inspection is carried out as the thirteenth step.
16. Finally, the printed board is placed into the transport box.
The Initial Phase of Wave Welding for PCBA Package
1. During the manufacturing process of PCBA, drying may entail residual solvents and moisture. If bubbles appear on the PCB during the welding process, it is advisable to conduct a PCB pre-drying process beforehand. For PCBA with a thickness of 1.5mm or less, a lower temperature and shorter duration can be selected, while multi-layer PCBs can undergo continuous drying at 105 degrees Celsius for two to four hours. PCB pre-drying effectively eliminates residual stress accumulated during PCBA board production, thereby reducing PCB warpage and wave soldering-induced deformation.
2. Preheating temperature in the preheating stage is not fixed; it varies according to factors such as duration, power supply voltage, ambient temperature, season, and ventilation.
3. The solder we aim to melt should exhibit good fluidity and wettability. Consequently, the soldering temperature must surpass the melting point of the solder itself.
4. Transmission of PCBA packages during welding is closely associated with transmission speed. Determining the optimal transmission speed in wave soldering depends on factors such as production efficiency, the thermal capacity of PCB substrates and components, preheating temperature, and others.
5. Transmission inclination angle, currently most prevalent in the PCBA packaging industry, ranges from 4° to 6°. This range effectively mitigates undesirable occurrences like tin deficiency, insufficient tin, and uneven tinning.
2. The Wave Soldering Process for Single Machine Type
3. Firstly, the component leads are formed, and the printed board is pasted with solder resist tape.
4. Secondly, components are inserted.
5. Thirdly, the printed board is placed into the welding fixture.
6. Fourthly, flux is applied.
7. Next, preheating occurs.
8. Subsequently, wave soldering takes place.
9. Cooling follows as the seventh step.
10. The printed board is then removed.
11. Solder resist tape is peeled off as the ninth step.
12. Inspection is conducted as the tenth step.
13. Xin L welding is performed as the eleventh step.
14. Cleaning ensues as the twelfth step.
15. Another inspection is carried out as the thirteenth step.
16. Finally, the printed board is placed into the transport box.
The Initial Phase of Wave Welding for PCBA Package
1. During the manufacturing process of PCBA, drying may entail residual solvents and moisture. If bubbles appear on the PCB during the welding process, it is advisable to conduct a PCB pre-drying process beforehand. For PCBA with a thickness of 1.5mm or less, a lower temperature and shorter duration can be selected, while multi-layer PCBs can undergo continuous drying at 105 degrees Celsius for two to four hours. PCB pre-drying effectively eliminates residual stress accumulated during PCBA board production, thereby reducing PCB warpage and wave soldering-induced deformation.
2. Preheating temperature in the preheating stage is not fixed; it varies according to factors such as duration, power supply voltage, ambient temperature, season, and ventilation.
3. The solder we aim to melt should exhibit good fluidity and wettability. Consequently, the soldering temperature must surpass the melting point of the solder itself.
4. Transmission of PCBA packages during welding is closely associated with transmission speed. Determining the optimal transmission speed in wave soldering depends on factors such as production efficiency, the thermal capacity of PCB substrates and components, preheating temperature, and others.
5. Transmission inclination angle, currently most prevalent in the PCBA packaging industry, ranges from 4° to 6°. This range effectively mitigates undesirable occurrences like tin deficiency, insufficient tin, and uneven tinning.
