Latest Updates in PCB Expertise

  • IPC-ESD-2020

    IPC-ESD-2020 is the standard for developing electrostatic discharge control programs, providing guidance on handling and protection during ESD-sensitive periods based on historical experiences.

  • IPC-SA-61A

    IPC-SA-61A is a manual for semi-aqueous cleaning after soldering, covering all aspects of chemicals, production residues, equipment, processes, and environmental considerations.

  • IPC-AC-62A

    IPC-AC-62A is a manual for hydration cleaning after soldering, detailing manufacturing residues, aqueous cleaners, equipment, quality control, and safety measures.

  • IPC-DRM-40E

    IPC-DRM-40E is a desktop reference manual for through-hole solder joint evaluation, including descriptions of components, soldering surfaces, and various solder joint defects.

  • IPC-TA-722

    IPC-TA-722 is the Welding Technology Evaluation Manual, covering various aspects of welding technology such as manual welding, wave soldering, and infrared welding.

  • IPC-7525

    IPC-7525 is the Stencil Design Guide, providing instructions for designing solder paste and surface mount adhesive-coated stencils.

  • IPC / EIAJ-STD-004

    IPC / EIAJ-STD-004 outlines flux specification requirements, including technical indicators and classification based on halide content and activation degree.

  • IPC / EIAJ-STD-005

    IPC / EIAJ-STD-005 lists solder paste specification requirements, covering characteristics like metal content, viscosity, and soldering performance.

  • IPC / EIAJ-STD-006A

    IPC / EIAJ-STD-006A specifies requirements for electronic-grade solder alloys, fluxes, and non-flux solid solders.

  • IPC-Ca-821

    IPC-Ca-821 details general requirements for thermally conductive adhesives used in bonding components.

  • IPC-3406

    IPC-3406 offers guidance for coating adhesives on conductive surfaces as an alternative to soldering in electronics manufacturing.

  • IPC-AJ-820

    IPC-AJ-820 is an assembly and soldering manual covering inspection techniques, solder joint materials, design guidelines, and quality assurance in detail.

  • IPC-7530

    IPC-7530 provides guidelines for temperature profiles in batch soldering processes, aiding in establishing optimal soldering temperature profiles.

  • IPC-TR-460A

    IPC-TR-460A is a troubleshooting guide for wave soldering processes, offering recommended corrective actions for common issues.

  • IPC / EIA / JEDECJ-STD-003A

    IPC / EIA / JEDECJ-STD-003A focuses on solderability testing of printed circuit boards.

J-STD-013

Latest Updates in PCB Packaging Technologies

  • IPC-7095

    Guidelines for Spherical Grid Array (SGA) device design and assembly processes.

  • IPC-M-I08

    Manual for cleaning instructions to optimize product cleaning processes.

  • IPC-CH-65-A

    Guidelines on cleaning methods in printed circuit board assembly, including emerging technologies.

  • IPC-SC-60A

    Manual on solvent cleaning post-soldering processes for efficient PCB manufacturing.

  • IPC-9201

    Handbook on Surface Insulation Resistance (SIR) testing and troubleshooting techniques.

  • IPC-DRM-53

    Introduction to Electronic Assembly Desktop Reference Manual for mounting techniques.

  • IPC-M-103

    Standard surface mount assembly manual with 21 related IPC documents.

  • IPC-M-I04

    Printed circuit board assembly manual standard with the top 10 IPC documents.

  • IPC-CC-830B

    Specifications for electronic insulating compounds in PCB assembly.

  • IPC-S-816

    Process guide and troubleshooting list for surface mount technology.

  • IPC-CM-770D

    Installation instructions for PCB components in both manual and automated assembly.

  • IPC-7129

    Failure rate calculation and manufacturing indicators for PCB assembly quality control.

  • IPC-9261

    Estimation of assembly yield and failures per million opportunities during PCB manufacturing.

  • IPC-D-279

    Guidelines for designing reliable surface mount technology (SMT) printed circuit board assemblies.

  • IPC-2546

    Key requirements for printed circuit board assembly processes and material motion systems.

  • IPC-PE-740A

PCB Manufacturing and Assembly Troubleshooting Guide

Discover solutions for common problems encountered during PCB design, manufacturing, assembly, and testing. This comprehensive guide features real-life case studies and recommended corrective actions.

IPC-6010 Standard

Explore the IPC-6010 standard, a set of quality standards and performance specifications specifically tailored for printed circuit boards. Developed by the American Printed Circuit Board Manufacturers, this document outlines essential specifications to ensure optimal PCB performance.

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