1. When COB has been widely used in mass-produced electronic products, the use of PCBA MCM in PCs, cameras, and other products is still in a transitional phase.
2. The total cost of implementing PCBA MCM on the PCB of standard products is higher compared to using single-chip ICs.
3. In the more than 20 years since PCBA MCM began to be used, although its advantages have been acknowledged, its high cost means it is still infrequently used in high-end products.
4. The primary reasons for the limited success of PCBA MCM include KGD (Known Good Die) issues, high substrate costs, high packaging costs, and low yield rates.
5. Internationally, PCBA MCM is often referred to as PCBA MCMS (Must Cost Millions) due to the substantial costs involved.
6. Recently, however, the tremendous market demand and advancements in technology, particularly in packaging, have led to the development of various PCBA MCM packaging technologies, including cost-effective FCBGA PCBA MCM, mastered by some foreign companies.
2. The total cost of implementing PCBA MCM on the PCB of standard products is higher compared to using single-chip ICs.
3. In the more than 20 years since PCBA MCM began to be used, although its advantages have been acknowledged, its high cost means it is still infrequently used in high-end products.
4. The primary reasons for the limited success of PCBA MCM include KGD (Known Good Die) issues, high substrate costs, high packaging costs, and low yield rates.
5. Internationally, PCBA MCM is often referred to as PCBA MCMS (Must Cost Millions) due to the substantial costs involved.
6. Recently, however, the tremendous market demand and advancements in technology, particularly in packaging, have led to the development of various PCBA MCM packaging technologies, including cost-effective FCBGA PCBA MCM, mastered by some foreign companies.
