**One. Line**

1. **Minimum Line Width:** 6 mil (0.153 mm). In PCB manufacturing, if the line width is less than 6 mil, it cannot be produced. If design conditions allow, a larger width is preferable; generally, around 10 mil is considered optimal. A wider line width improves factory yield, making this an essential factor in design.

2. **Minimum Line Spacing:** 6 mil (0.153 mm). This refers to the spacing between lines, with the distance from a line to a pad also needing to be no less than 6 mil. From a production perspective, wider spacing is advantageous, and a typical guideline is 10 mil. Again, if design conditions allow, a larger spacing is recommended. This is crucial, and must be factored into the design.

3. **Distance Between Line and Outline:** 0.508 mm (20 mil).

—

**Two. Via (Commonly Known as Conductive Hole)**

1. **Minimum Aperture:** 0.3 mm (12 mil).

2. The minimum diameter for a via hole (VIA) should not be less than 0.3 mm (12 mil). The pad size on one side should not be less than 6 mil (0.153 mm), and there are no restrictions if it exceeds 8 mil (0.2 mm) (refer to Figure 3). This aspect is very important, and must be considered in the design.

3. The spacing between via holes (edge to edge) must be no less than 6 mil, preferably greater than 8 mil. This point is critical and should be included in the design considerations.

4. The distance between the pad and the outline should be 0.508 mm (20 mil).

—

I hope this meets your needs!

5. a. Hole to line spacing:

NPTH (without solder ring): After hole compensation of 0.15mm, the distance from the line should exceed 0.2mm.

PTH (with solder ring): After the hole compensation of 0.15mm, the distance from the line should exceed 0.3mm.

b. Hole to hole spacing:

PTH (with solder ring): After hole compensation of 0.15mm, the hole-to-hole spacing should be above 0.45mm.

NPTH hole: After hole compensation of 0.15mm, the hole-to-hole spacing should be above 0.2mm.

VIA: The spacing can be slightly reduced.

Three. PAD (commonly known as plug-in hole (PTH)):

1. The size of the plug-in hole is determined by your component but must be larger than the component pin. A minimum increase of at least 0.2mm is recommended; for a component pin of 0.6mm, design at least 0.8mm to avoid insertion difficulties due to processing tolerances.

2. The outer ring of the plug-in hole (PTH) pad should not be less than 0.2mm (8mil) on one side.

3. The hole-to-hole spacing (edge to edge) for plug-in holes (PTH) cannot be less than 0.3mm; larger spacing is preferable (as shown in Figure 3). This is crucial for circuit board production and must be considered in design.

4. The distance between the PCB pad and the outline line is 0.508mm (20mil).

Four. Solder mask:

1. The window for the plug-in hole must not be less than 0.1mm (4mil) on one side for SMD.

Five. Characters (the design significantly impacts production; clarity is closely related to character design):

1. The character width must not be less than 0.153mm (6mil), the height must not be less than 0.811mm (32mil), and the width-to-height ratio is 5; for example, if the width is 0.2mm, the height should be 1mm, and so forth.

6. Non-metalized slotted holes: The minimum spacing of slotted holes should be no less than 1.6mm; otherwise, it will considerably increase milling difficulty.

7. PCB imposition:

1. There should be no gaps in the imposition. The gap must not be less than 1.6mm (for board thickness of 1.6mm); otherwise, milling difficulty will increase significantly. The size of the imposition work board may vary based on equipment. The gap for no-gap imposition should be around 0.5mm, and the process edge must not be less than 5mm.