Factors Influencing Surface Foaming in PCBA Circuit Board Assembly

• Surface Quality Factors:
  • Board cleanliness
  • Surface microscopic roughness
• Issues Caused by Poor Binding Force:
  • Coating stress
  • Mechanical stress
  • Thermal stress

Factors Contributing to Poor Panel Quality

• Ineffective Substrate Removal:
• Challenges with Thinner Layers:
• Problems with Thin Inner Layers:
• Enhancing Control Over the Brushing Process:
• Optimizing Parameters in Cold Temperatures:
• Surface Inspection After Micro-Etching:
• Oil Removal Considerations:
• Post-Plating Procedures:

Common Causes of Board Foaming:

• Equipment Technology Levels

WellCircuits Limited: Leading PCB Manufacturer

WellCircuits Limited utilizes Samsung SM series automatic SMT machines for efficient production and express delivery. With a daily capacity of 4 million points, stringent quality control measures, and a 2000 square meter dust-free workshop, WellCircuits Limited upholds the IATF 16949 and ISO9001-2000 quality standards, ensuring top-notch products and customer satisfaction.