In electronic equipment, the operation generates heat, leading to a rapid increase in internal temperature. Failing to dissipate heat in a timely manner can result in overheating and decreased performance reliability. Therefore, it is essential to implement effective heat dissipation methods on the PCB circuit board.
Method 1: Heat Dissipation Through The PCB Board
Most commonly used PCB boards, such as copper-clad/epoxy glass cloth substrates and phenolic resin glass cloth substrates, have poor heat dissipation properties. Conducting heat through the PCB resin is insufficient, especially with the miniaturization and high-density mounting of electronic components. The solution lies in enhancing the PCB’s heat dissipation capacity, allowing it to transmit or emit heat directly from the heating element.
Method 2: High Heat-Generating Components, Radiators, and Heat Conduction Plates
For components that generate significant heat (up to 3), adding a heat sink or heat pipe is advisable. If the temperature remains high, a fan-assisted heat sink can improve the dissipation effect. In cases where multiple heating devices are present, a customized larger heat dissipation cover or a flat heat sink can be utilized. The cover is placed on the component surface, enhancing heat dissipation. Inconsistent component height during assembly may hinder effectiveness, necessitating the use of a soft thermal phase change thermal pad to optimize heat dissipation.
Method 3: Proper Arrangement for Free Convection Air Cooling
For equipment adopting free convection air cooling, vertically or horizontally arranging integrated circuits (or other devices) is recommended.
Method 4: Rational Wiring Design for Heat Dissipation
The resin in the PCB has limited thermal conductivity, but copper foil lines and holes excel in heat conduction. Increasing the copper foil percentage and incorporating thermally conductive holes are effective heat dissipation measures. Assessing the PCB’s heat dissipation capacity involves calculating the equivalent thermal conductivity of the composite material, which includes the insulating substrate.
By implementing these heat dissipation techniques, the PCB board’s performance and reliability can be significantly improved.