Second, vacuum skin packaging.
Operating procedures:
1. Preparation:
Position the PE film, manually operate to check if each mechanical action is normal, set the PE film heating temperature, and vacuum time.
2. Stacking boards:
When the number of stacked boards is fixed, and the height is also fixed, it is important to consider how to stack them to maximize output and save materials. The following principles should be followed:
a. The distance between each stack of boards depends on the specifications (thickness) and the standard 0.2m/m of the PE film. The spacing should be at least twice the total thickness of each stack to ensure proper adhesion without wasting material.
b. The distance between the outermost board and the edge should also be at least twice the thickness of the board.
c. For smaller panel sizes, alternative packaging methods such as containers or separating stacks with cardboard can be considered to reduce waste and labor.
3. Start:
A. Press start to lower the heated PE film onto the table.
B. The bottom vacuum pump will suck in air and adhere the film to the circuit board.
C. Raise the outer frame after cooling.
D. Cut the PE film and open the chassis to separate each stack.
4. Packing:
Follow the customer’s packing specifications if designated, or establish factory packing specifications to protect the boards during transportation. Special attention should be paid to the packing of exported products.
5. Other Matters Needing Attention:
a. Ensure all necessary information is written outside the box, including “mark,” material number (P/N), version, quantity, and Made in China (if export).
b. Attach relevant quality certificates as required by the customer.
Packaging PCB boards is a simple task that requires careful attention to detail to prevent issues in the future.
Operating procedures:
1. Preparation:
Position the PE film, manually operate to check if each mechanical action is normal, set the PE film heating temperature, and vacuum time.
2. Stacking boards:
When the number of stacked boards is fixed, and the height is also fixed, it is important to consider how to stack them to maximize output and save materials. The following principles should be followed:
a. The distance between each stack of boards depends on the specifications (thickness) and the standard 0.2m/m of the PE film. The spacing should be at least twice the total thickness of each stack to ensure proper adhesion without wasting material.
b. The distance between the outermost board and the edge should also be at least twice the thickness of the board.
c. For smaller panel sizes, alternative packaging methods such as containers or separating stacks with cardboard can be considered to reduce waste and labor.
3. Start:
A. Press start to lower the heated PE film onto the table.
B. The bottom vacuum pump will suck in air and adhere the film to the circuit board.
C. Raise the outer frame after cooling.
D. Cut the PE film and open the chassis to separate each stack.
4. Packing:
Follow the customer’s packing specifications if designated, or establish factory packing specifications to protect the boards during transportation. Special attention should be paid to the packing of exported products.
5. Other Matters Needing Attention:
a. Ensure all necessary information is written outside the box, including “mark,” material number (P/N), version, quantity, and Made in China (if export).
b. Attach relevant quality certificates as required by the customer.
Packaging PCB boards is a simple task that requires careful attention to detail to prevent issues in the future.
