PCB Capability
Over the last decade, WellCircuitshas grown from a green hand to an expert in the EMS industry.The investment put in talent and advanced production equipment go up from million to hundred millions to enhance our production capability and efficiency.
Rigid PCB Capability
Layer Count
1-60 Layers
Min Trace/Space
2mil/2mil
Min Hole
Laser-drilled 0.075mm
Mechanical: 0.2mm
Laminate
FR-4, High TG, Halogen-free, High-speed, High- frequency
Min Annular Ring
50um
Max Size
546mm X 622mm
Final Thickness
0.3mm-3.5mm
Finish Treatment
Advanced Technology
Flexible PCB Capability
Layer Count
1-46 Layers
8L-FPC-StackupMin Trace/Space
2mil/2mil
Min Hole
Laser drilling: 3mil
Mechanical drilling: 4mil
Mechanical
Laminate
Polyimide
DuPont Kapton & Pyralux
Panasonic FELIOS
Max Size
20″x40″
Soldermask & Coverlay
Soldermask：Green,Black,Red,White,Blue
Coverlay：Yellow,Black,White
Final Thickness
0.12-0.4 mm
Finish Treatment
LF HASL, OSP, ENIG, Immersion tin, Gold fingers
Stiffener Material
FR-4, SUS, Polyimid
Rigid-Flex PCB Capability
Layer Count
2-48 Layers
Materials: Dupont AP8535,AP8545; Panasonic RF775, RF777,
Feature
Gold finger, Tented via, blind &buried via, Impedance control, Carbon ink, Peelable mask / Kapton, countersink, BGA
Min Trace/Space
3mil/3mil
Min Hole
5mil
Max Size
500 x 1000mm
Soldermask & Coverlay
Soldermask：Green,Black,Red,White,Blue
Coverlay：Yellow,Black,White
Final Thickness
0.2mm- 7mm
Finish Treatment
LF HASL, OSP, ENIG, Immersion tin, Gold fingers
Min Hole Ring
5mil
HDI PCB Capability
Layer Count
2-26 Layer
1-4 tiers & anylayer
Min Trace/Space
2mil/2mil
Min Hole
2.5 mil
Max Size
500 x 1000mm
Finish Treatment
HASL/Lead-Free HASL/OSP
Wire Bondable Gold/Hard Gold
Immersion Au/Immersion Tin /ENIG/ENEPIG
Final Thickness
0.3mm-3.5mm
Advanced Technology
Microvia, Blind via & buried vias
Stepping vias
High-Frequency PCB Capability
Layer Count
2-36 Layers
Laminate
Isola\Rogers\Arlon
RO3000,RO4000 series
408HR, MT77,MT40
Min Trace/Space
2mil / 2mil
Min Hole
Laser-drilled 0.075mm
Mechanical hole: 0.2mm
Max Size
546mm X 622mm
Soldermask & Coverlay
Soldermask：Green,Black,Red,White,Blue
Coverlay：Yellow,Black,White
Final Thickness
0.3mm-3.5mm
Finish Treatment
Wire Bondable Gold/Hard Gold
Immersion Au/Immersion Tin /ENIG/ENEPIG
Quality Standard
IPC II, IPC III, Ro