As the world transitions to 5G, the deployment of mini 5G base stations is becoming increasingly widespread. These base stations are installed every 100 meters in urban areas, mounted on buildings, walls, rooftops, traffic lights, and other infrastructure. This approach contrasts sharply with the older 4G LTE network, where base stations are typically located several kilometers apart with large antenna towers. 5G base stations operating at 28 GHz require new materials for their PCBs. These materials include fast laminates with low dielectric constants (Dk) that help to increase wave speed and reduce transmission loss by up to 30%.
The 5G millimeter-wave technology also demands high-precision impedance control, with tolerance levels as tight as ±5%. This necessitates highly accurate PCB circuit dimensions and consistent internal circuit measurements across all panels. To achieve these stringent requirements, advanced production techniques are essential. For example, the production line should integrate advanced Direct Imaging (DI) technology for precise circuit patterning and solder mask applications. Additionally, Automated Optical Inspection (AOI) should be used for integrated 2D measurements, ensuring that complex, high-density digital boards meet the required quality standards.
In terms of server design for 5G communication, both local and central servers must work together to support the network. These servers include large-scale data centers responsible for creating, processing, storing, and transmitting vast amounts of data with minimal latency. To enhance efficiency, edge computing is integrated into the network. This allows real-time data created by sensors or users at the network edge (i.e., the device level) to be processed locally, rather than in the cloud.
Supporting this high-performance infrastructure requires advanced PCB designs, typically ranging from 12 to 22 layers, with some data servers extending up to 30 layers. The transmission lines in these PCBs must be carefully engineered to maintain strict impedance control to handle the high frequencies associated with 5G. Proper impedance management is crucial to ensure signal integrity and reliable communication, particularly as the frequency of the 5G signal increases.
In conclusion, the demands of 5G communications, including the high-frequency millimeter-wave technology and the need for minimal latency in both base stations and servers, necessitate cutting-edge PCB materials, design, and manufacturing techniques. Ensuring the highest level of precision and quality control throughout the production process is key to the success of 5G network infrastructure.
To support high-performance computing (HPC) units, the IC carrier board must adopt a new design with an area of up to 110mm x 110mm. This larger size accommodates bigger chips and requires the use of finer lines and pitches, as low as 5/5μm. Achieving this level of precision demands advanced manufacturing processes that can handle the intricacies of modern PCB designs.
For effective defect detection, 5G server boards require high depth of field (DoF) capabilities in both direct imaging (DI) and automated optical inspection (AOI) systems during production. AOI systems that integrate 2D measurement and inspection functions are essential for stringent impedance control. DI plays a critical role in ensuring precise alignment of the upper and lower layers, while also maintaining strict impedance requirements and providing solder-resistance for large boards. Moreover, AOI systems enable fully automated high-volume production of multi-layer boards (MLBs). Additionally, an automated optical forming and repair system is vital for minimizing damage when addressing shorts and open circuits on the PCB, ensuring a reliable and efficient manufacturing process.
**5G Smartphone Manufacturing**
Next-generation 5G smartphones rely heavily on mSAP (modified semi-additive process) and SLP (substrate-like PCB) technologies, which use ultra-thin connection devices to efficiently transmit signals and power while reducing power consumption. The demand for smaller, lighter, and more functional devices necessitates the use of flexible and rigid-flex combined PCBs. Moreover, the complex multi-input multi-output (MIMO) antenna systems deployed in 5G smartphones often use antenna-in-package (AiP) technology to enhance device performance.
Both mSAP/SLP and flexible PCBs require advanced AOI systems capable of laser hole detection to ensure accurate positioning and high-quality connection devices. A sophisticated DI system is crucial for achieving precise line patterning in mSAP/SLP boards, while flexible and rigid-flex boards require high DoF capabilities to maintain production quality. These technologies not only ensure fine line patterning but also enable higher productivity, which is essential for meeting the growing demand for 5G smartphone components. Automated optical shaping and repair systems further help reduce the number of defective boards by effectively addressing defects identified during the inspection process.
**Conclusion**
By leveraging cutting-edge manufacturing technologies, PCB designers can meet the stringent demands of 5G infrastructure and devices. Key processes such as direct laser imaging (DLI), automated optical inspection (AOI), and automated optical shaping and repair play a pivotal role in overcoming challenges such as low latency, high-frequency requirements, and the use of complex, fragile materials. These technologies not only support the design and production of 5G components but also contribute to improving yields in mass production environments—critical for the successful deployment and operation of 5G networks.
The 5G millimeter-wave technology also demands high-precision impedance control, with tolerance levels as tight as ±5%. This necessitates highly accurate PCB circuit dimensions and consistent internal circuit measurements across all panels. To achieve these stringent requirements, advanced production techniques are essential. For example, the production line should integrate advanced Direct Imaging (DI) technology for precise circuit patterning and solder mask applications. Additionally, Automated Optical Inspection (AOI) should be used for integrated 2D measurements, ensuring that complex, high-density digital boards meet the required quality standards.
In terms of server design for 5G communication, both local and central servers must work together to support the network. These servers include large-scale data centers responsible for creating, processing, storing, and transmitting vast amounts of data with minimal latency. To enhance efficiency, edge computing is integrated into the network. This allows real-time data created by sensors or users at the network edge (i.e., the device level) to be processed locally, rather than in the cloud.
Supporting this high-performance infrastructure requires advanced PCB designs, typically ranging from 12 to 22 layers, with some data servers extending up to 30 layers. The transmission lines in these PCBs must be carefully engineered to maintain strict impedance control to handle the high frequencies associated with 5G. Proper impedance management is crucial to ensure signal integrity and reliable communication, particularly as the frequency of the 5G signal increases.
In conclusion, the demands of 5G communications, including the high-frequency millimeter-wave technology and the need for minimal latency in both base stations and servers, necessitate cutting-edge PCB materials, design, and manufacturing techniques. Ensuring the highest level of precision and quality control throughout the production process is key to the success of 5G network infrastructure.
To support high-performance computing (HPC) units, the IC carrier board must adopt a new design with an area of up to 110mm x 110mm. This larger size accommodates bigger chips and requires the use of finer lines and pitches, as low as 5/5μm. Achieving this level of precision demands advanced manufacturing processes that can handle the intricacies of modern PCB designs.
For effective defect detection, 5G server boards require high depth of field (DoF) capabilities in both direct imaging (DI) and automated optical inspection (AOI) systems during production. AOI systems that integrate 2D measurement and inspection functions are essential for stringent impedance control. DI plays a critical role in ensuring precise alignment of the upper and lower layers, while also maintaining strict impedance requirements and providing solder-resistance for large boards. Moreover, AOI systems enable fully automated high-volume production of multi-layer boards (MLBs). Additionally, an automated optical forming and repair system is vital for minimizing damage when addressing shorts and open circuits on the PCB, ensuring a reliable and efficient manufacturing process.
**5G Smartphone Manufacturing**
Next-generation 5G smartphones rely heavily on mSAP (modified semi-additive process) and SLP (substrate-like PCB) technologies, which use ultra-thin connection devices to efficiently transmit signals and power while reducing power consumption. The demand for smaller, lighter, and more functional devices necessitates the use of flexible and rigid-flex combined PCBs. Moreover, the complex multi-input multi-output (MIMO) antenna systems deployed in 5G smartphones often use antenna-in-package (AiP) technology to enhance device performance.
Both mSAP/SLP and flexible PCBs require advanced AOI systems capable of laser hole detection to ensure accurate positioning and high-quality connection devices. A sophisticated DI system is crucial for achieving precise line patterning in mSAP/SLP boards, while flexible and rigid-flex boards require high DoF capabilities to maintain production quality. These technologies not only ensure fine line patterning but also enable higher productivity, which is essential for meeting the growing demand for 5G smartphone components. Automated optical shaping and repair systems further help reduce the number of defective boards by effectively addressing defects identified during the inspection process.
**Conclusion**
By leveraging cutting-edge manufacturing technologies, PCB designers can meet the stringent demands of 5G infrastructure and devices. Key processes such as direct laser imaging (DLI), automated optical inspection (AOI), and automated optical shaping and repair play a pivotal role in overcoming challenges such as low latency, high-frequency requirements, and the use of complex, fragile materials. These technologies not only support the design and production of 5G components but also contribute to improving yields in mass production environments—critical for the successful deployment and operation of 5G networks.
