Be sure to clearly identify the characteristics of the original welding point before desoldering, and do not start easily.
(1) Take care not to damage the components, wires, and surrounding parts to be removed;
(2) Ensure the pads and printed conductors on the PCB are not damaged during desoldering;
(3) For electronic components that are suspected to be damaged, consider cutting off the pins first before removal to minimize potential damage;
(4) Try to avoid moving the position of other original devices, and if necessary, take measures to ensure proper recovery.
(1) Strictly control the temperature and heating time to prevent damage to other components from high temperatures.
Generally, the time and temperature required for desoldering are longer than those for soldering.
(2) Be cautious when desoldering to avoid excessive force.
The packaging strength of components decreases at high temperatures, and excessive pulling, twisting, and bending can lead to damage to components and pads.
(3) Use a solder absorber to remove the solder from the solder joint.
This can reduce the soldering time and the possibility of damage to the PCB, and components can be directly removed to reduce the potential for damage.
(1) Point desoldering method
For horizontally-mounted resistance and capacitance components with widely spaced solder points, use a soldering iron to heat and pull out the solder points. If a pin is bent, straighten it with the soldering iron before removal. During desoldering, heat the pin of the component to be removed with an electric soldering iron while the PCB is upright, and gently pull out the pin using forceps or needle-nosed pliers.
(2) Centralized desoldering method
For components with separate welding points, a hot air welder can be used to quickly heat several points and remove the solder at once.
(3) Reserved desoldering method
Use a solder absorber to remove the solder from the solder joint. If dealing with multi-pin electronic components, use an electronic heat fan for heating. For lap-welded components, apply flux to the solder joint and open it with an electric soldering iron. For hook welding components, first remove the solder with the soldering iron, then melt the remaining solder with the iron while gently prying the pin with a shovel. Use caution to prevent splashing of molten solder.
(4) Shear desoldering method
If the components’ pins and wires are surplus or damaged, they can be cut off first and then the wire ends on the solder pads can be removed.
(1) Ensure the re-welded pins and wires of the components are consistent with the original as much as possible;
(2) Ensure blocked pad holes are cleared;
(3) Restore any components that have been moved.
(1) Take care not to damage the components, wires, and surrounding parts to be removed;
(2) Ensure the pads and printed conductors on the PCB are not damaged during desoldering;
(3) For electronic components that are suspected to be damaged, consider cutting off the pins first before removal to minimize potential damage;
(4) Try to avoid moving the position of other original devices, and if necessary, take measures to ensure proper recovery.
(1) Strictly control the temperature and heating time to prevent damage to other components from high temperatures.
Generally, the time and temperature required for desoldering are longer than those for soldering.
(2) Be cautious when desoldering to avoid excessive force.
The packaging strength of components decreases at high temperatures, and excessive pulling, twisting, and bending can lead to damage to components and pads.
(3) Use a solder absorber to remove the solder from the solder joint.
This can reduce the soldering time and the possibility of damage to the PCB, and components can be directly removed to reduce the potential for damage.
(1) Point desoldering method
For horizontally-mounted resistance and capacitance components with widely spaced solder points, use a soldering iron to heat and pull out the solder points. If a pin is bent, straighten it with the soldering iron before removal. During desoldering, heat the pin of the component to be removed with an electric soldering iron while the PCB is upright, and gently pull out the pin using forceps or needle-nosed pliers.
(2) Centralized desoldering method
For components with separate welding points, a hot air welder can be used to quickly heat several points and remove the solder at once.
(3) Reserved desoldering method
Use a solder absorber to remove the solder from the solder joint. If dealing with multi-pin electronic components, use an electronic heat fan for heating. For lap-welded components, apply flux to the solder joint and open it with an electric soldering iron. For hook welding components, first remove the solder with the soldering iron, then melt the remaining solder with the iron while gently prying the pin with a shovel. Use caution to prevent splashing of molten solder.
(4) Shear desoldering method
If the components’ pins and wires are surplus or damaged, they can be cut off first and then the wire ends on the solder pads can be removed.
(1) Ensure the re-welded pins and wires of the components are consistent with the original as much as possible;
(2) Ensure blocked pad holes are cleared;
(3) Restore any components that have been moved.
