Common Quality Issues in PCB Etching Process

  • Etching Surface Problems: Quality issues often stem from the accumulation of colloidal laminates on the copper surface, affecting etching speed and injection force.
  • Nozzle Blockage: Blockages in the etching equipment’s nozzle can lead to uneven etching, impacting the overall circuit board quality.
  • Maintenance Importance: Regular maintenance, including replacing worn parts like nozzles, is crucial to prevent issues such as slagging and chemical imbalance in the etching solution.
  • Side Erosion Effects: Prolonged exposure to the etching solution can cause side erosion, affecting wire precision and potentially leading to conductor short-circuiting.
  • Edge Protrusion Risks: Excessive edge protrusion from etching agents can result in conductor short-circuiting and electrical disconnections between wire points.

Factors Affecting Side Erosion

  • Etching Methods: Soak and bubble etching contribute to greater side erosion, while splash and spray etching result in less side erosion, with spray etching being the most effective.
  • Chemical Composition: Different etching solutions have varying chemical compositions, etching rates, and coefficients, impacting side erosion levels.
  • Etching Rate: Slower etching rates lead to more severe side etching, highlighting the importance of accelerating the etching process for better quality.
  • pH Levels: Controlling pH values below 8.5 in alkaline etching solutions helps minimize side erosion, with higher pH values exacerbating the issue.
  • Copper Concentration: High copper concentration solutions are beneficial for reducing side erosion, while low-density alkaline solutions can worsen the problem.
  • Material Recommendation: To minimize side etching of thin wires, using ultra-thin copper foil is recommended, as it reduces exposure time in the etching solution.

Addressing these common quality issues and understanding the factors influencing side erosion can significantly improve the PCB etching process and enhance overall circuit board quality.

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