Sure, here are the polished versions of the provided text:
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1. PCB manufacturing is a highly complex process, and understanding the PCB glossary is fundamental for personnel in the PCB industry. WellCircuits Limited offers key insights into some PCB glossary terms.
2. Accelerator: A chemical used to hasten a reaction or curing process, such as cobalt naphthenate, which accelerates the reaction of specific polyester resins. This term is often interchangeable with “promoter” and is typically used in conjunction with a catalyst, hardener, or curing agent.
3. Catalyst: A substance that accelerates the curing of a resin without becoming a part of the final product chemically.
4. Accuracy: The ability to position a hole precisely at its intended location.
5. Additive process: A method of creating conductive patterns by selectively depositing conductive material onto an unclad base material.
6. Adhesive: Generally, any substance used to enhance and maintain adhesion between two materials.
7. Aging: Changes in the properties of a material over time under specific conditions.
8. Annular ring: The circular band of conductive material that surrounds a hole completely.
9. Arc resistance: The duration it takes for an arc to create a conductive path in a material.
10. Artwork master: A precisely scaled layout used to generate the production master.
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These revisions aim to maintain clarity and conciseness while ensuring technical accuracy and coherence in the descriptions provided.
Sure, here are the edited and refined versions of each line:
Backup material: A material placed beneath a laminate stack where a drill terminates its drilling stroke.
Base material: The insulating material on which the printed wiring pattern is formed.
Base material thickness: The thickness of the base material excluding metal foil cladding or surface-deposited material.
Blind via: A conductive hole connecting an outerlayer with an innerlayer of a multilayer PCB without penetrating the entire board.
Buried via: A conductive hole connecting one innerlayer to another innerlayer of a multilayer PCB without reaching the outer surfaces.
Blistering: Localized swelling and separation between any layers of the base laminate or between the laminate and the metal cladding.
Burr: A ridge left on the copper surfaces after drilling.
Bonding layer: An adhesive layer used to bond other discrete layers during lamination.
Bond strength: The force per unit area required to separate two adjacent layers by a force perpendicular to the board surface, usually referring to the interface between copper and base material.
Bow: A lamination defect where deviation from planarity results in a smooth arc.
B-stage: An intermediate stage in the curing of a thermosetting resin, allowing it to flow and achieve final curing in the desired shape upon heating.
B-stage lot: The product resulting from a single mix of B-stage ingredients.
B-stage resin: A resin in an intermediate stage of a thermosetting reaction, softening upon heating and swelling when in contact with certain liquids, though not entirely fusing or dissolving.
Sure, here are the corrections and improvements for the provided text:
Capacitance: The property of a system of conductors and dielectrics that allows the storage of electricity when a potential difference exists between the conductors.
Capacitive coupling: The electrical interaction between two conductors caused by capacitance between them.
Carbide: Tungsten carbide, chemical formula WC. A hard, refractory material used for making drill bits used in PCB drilling.
Ceramic Leaded Chip Carrier (CLCC): A chip carrier made from ceramic (usually based on 90-96% alumina or beryllia) with compliant leads for terminations.
Chip Carrier (CC): An integrated circuit package, typically square-shaped, with a chip cavity in the center; its connections are usually on all four sides. (See Leaded Chip Carrier and Leadless Chip Carrier.)
Chip load (CL): The amount the drill moves downward per revolution; usually measured in mils (thousandths of an inch) per revolution.
Chlorinated hydrocarbon: An organic compound containing chlorine atoms in its chemical structure.
Circuit: The interconnection of electrical devices in one or more closed paths to perform a desired electrical or electronic function.
Clad: A condition of the base material where a relatively thin layer or sheet of metal foil (cladding) has been bonded to one or both sides. The resulting material is called metal-clad base material.
CNC: Computer Numerically Controlled. Refers to a machine with a computer that stores numerical information about location, drill size, and machine parameters, allowing the machine to execute these instructions.
Coat: To cover with a finishing, protective, or enclosing layer of any compound.
—
1. PCB manufacturing is a highly complex process, and understanding the PCB glossary is fundamental for personnel in the PCB industry. WellCircuits Limited offers key insights into some PCB glossary terms.
2. Accelerator: A chemical used to hasten a reaction or curing process, such as cobalt naphthenate, which accelerates the reaction of specific polyester resins. This term is often interchangeable with “promoter” and is typically used in conjunction with a catalyst, hardener, or curing agent.
3. Catalyst: A substance that accelerates the curing of a resin without becoming a part of the final product chemically.
4. Accuracy: The ability to position a hole precisely at its intended location.
5. Additive process: A method of creating conductive patterns by selectively depositing conductive material onto an unclad base material.
6. Adhesive: Generally, any substance used to enhance and maintain adhesion between two materials.
7. Aging: Changes in the properties of a material over time under specific conditions.
8. Annular ring: The circular band of conductive material that surrounds a hole completely.
9. Arc resistance: The duration it takes for an arc to create a conductive path in a material.
10. Artwork master: A precisely scaled layout used to generate the production master.
—
These revisions aim to maintain clarity and conciseness while ensuring technical accuracy and coherence in the descriptions provided.
Sure, here are the edited and refined versions of each line:
Backup material: A material placed beneath a laminate stack where a drill terminates its drilling stroke.
Base material: The insulating material on which the printed wiring pattern is formed.
Base material thickness: The thickness of the base material excluding metal foil cladding or surface-deposited material.
Blind via: A conductive hole connecting an outerlayer with an innerlayer of a multilayer PCB without penetrating the entire board.
Buried via: A conductive hole connecting one innerlayer to another innerlayer of a multilayer PCB without reaching the outer surfaces.
Blistering: Localized swelling and separation between any layers of the base laminate or between the laminate and the metal cladding.
Burr: A ridge left on the copper surfaces after drilling.
Bonding layer: An adhesive layer used to bond other discrete layers during lamination.
Bond strength: The force per unit area required to separate two adjacent layers by a force perpendicular to the board surface, usually referring to the interface between copper and base material.
Bow: A lamination defect where deviation from planarity results in a smooth arc.
B-stage: An intermediate stage in the curing of a thermosetting resin, allowing it to flow and achieve final curing in the desired shape upon heating.
B-stage lot: The product resulting from a single mix of B-stage ingredients.
B-stage resin: A resin in an intermediate stage of a thermosetting reaction, softening upon heating and swelling when in contact with certain liquids, though not entirely fusing or dissolving.
Sure, here are the corrections and improvements for the provided text:
Capacitance: The property of a system of conductors and dielectrics that allows the storage of electricity when a potential difference exists between the conductors.
Capacitive coupling: The electrical interaction between two conductors caused by capacitance between them.
Carbide: Tungsten carbide, chemical formula WC. A hard, refractory material used for making drill bits used in PCB drilling.
Ceramic Leaded Chip Carrier (CLCC): A chip carrier made from ceramic (usually based on 90-96% alumina or beryllia) with compliant leads for terminations.
Chip Carrier (CC): An integrated circuit package, typically square-shaped, with a chip cavity in the center; its connections are usually on all four sides. (See Leaded Chip Carrier and Leadless Chip Carrier.)
Chip load (CL): The amount the drill moves downward per revolution; usually measured in mils (thousandths of an inch) per revolution.
Chlorinated hydrocarbon: An organic compound containing chlorine atoms in its chemical structure.
Circuit: The interconnection of electrical devices in one or more closed paths to perform a desired electrical or electronic function.
Clad: A condition of the base material where a relatively thin layer or sheet of metal foil (cladding) has been bonded to one or both sides. The resulting material is called metal-clad base material.
CNC: Computer Numerically Controlled. Refers to a machine with a computer that stores numerical information about location, drill size, and machine parameters, allowing the machine to execute these instructions.
Coat: To cover with a finishing, protective, or enclosing layer of any compound.
