PCB Testing Method Two:

1. Import the layer file and conduct checks, arrangement, and alignment. Rename the outer layers to fronrear and the inner layer to ily02, ily03, ily04neg (if it is a negative film), rear, rearmneg.
2. Add three layers and duplicate the two solder mask layers and the drilling layer to the added three layers respectively, renaming them to fronmneg, rearmneg, mehole. For blind and buried holes, they can be named met01-02, met02-05, met05-06, etc.
3. Eliminate any LINE or other elements that impact the network, then convert the PAD corresponding circuit layer of the solder mask layer into PAD.
4. Combine the positive and negative films, retaining the positives. Modify the hole attribute of the MEHOLE layer to PAD, then export each layer in GENESIS.
5. Define each layer and conduct network analysis, saving the test point results.
6. Import the *.ezf file stored by EZFIXTURE into EZPROBE, choose the smallest probe to execute the minute hand, then export the C01 of the drill belt, and read S01 into GENESIS.
7. Adjust C01 and S01 to round with D code of 8mil, mirror C01, and then duplicate them to the fronmneg and rearmneg layers respectively, assigning fronneg as the front layer test point and rearmneg as the back test point. Activate all layers and shift to 10,10mm.
8. Name the gerber files: fron, ily02, ily03, ily04neg, ilyo5neg, rear, fronmneg, rearmneg, meholemet01-02, met02-09, met09-met10 layers. This method is more efficient than the first, saving time for testing.

The test duration for each board varies based on the number of points and the network. A report file will include the estimated time for board testing, and the actual test time generally aligns with the estimated time. The FX3000 series flying probe tester has enhanced accuracy and can boost test speed by approximately 20% through speed adjustments, reduced waiting times, lowered Z-axis lifting height, and automatic restoration of short circuits. Other factors influencing test time encompass open and short circuits, surface treatment conductivity, operator’s reference point, and the board’s characteristics. Certain boards may necessitate special support frames for testing, leading to an extension in test time.