**One, PCB Packaging Method**

1. **Process Destination**

The process of “packaging” has garnered significant attention in PCB circuit board manufacturing, though it is often viewed as less critical than the various stages of production. The main reasons for this perception are twofold: firstly, it typically does not generate added value; secondly, the manufacturing industry in Taiwan has historically overlooked this aspect. The unquantified advantages that effective product packaging can provide are often underestimated.

2. **Discussion on Pre-Packaging**

The previous packaging techniques, as outlined in the table of outdated shipping methods, highlight several shortcomings. Presently, some smaller factories still utilize these methods for packaging. The domestic production capacity for PCB circuit boards is expanding rapidly, predominantly for export. As a result, competition is intense. Skill level and quality are now primarily dictated by customer expectations, and packaging quality must meet these standards. Electronic manufacturers with even minimal planning now require PCB suppliers to adopt specific packaging protocols. The following points must be addressed, some of which may even be stipulated as shipping packaging standards:

1. Vacuum packaging is essential.

2. The number of boards per stack should be minimized based on their size.


3. Standards for the tightness of each stack of PE film and the regulations governing margin width

4. Standard requirements for PE film and Air Bubble Sheet

5. Carton weight standards and other considerations

6. Are there any specific guidelines for placing buffers in front of the boards inside the carton?

7. Resistance rate standards after sealing

8. Quantity limits per box

Current domestic vacuum skin packaging (Vacuum Skin Packaging) varies significantly, with the primary differences being the usable working area and the level of automation.

3. Vacuum Tight Packaging (Vacuum Skin Packaging)

**Operation Procedure**

A. **Preparation**: Position the PE film, manually check that the mechanical actions function properly, and set the PE film heating temperature and vacuum duration, among other parameters.

B. **Warehouse Boards**: When the number of stacked boards is fixed, their height is also determined. At this point, it’s crucial to consider how to stack them to maximize output and conserve material. Below are some criteria:

a. The gap between each stack of boards depends on the standard (thickness) of the PE film, with a standard of 0.2 mm. Using the principles of heating, softening, and stretching, the vacuum pulls everything together, with the board covered in bubble wrap. The gap should generally be at least twice the total thickness of each stack. If the gap is too large, it may spoil the material; if too small, it becomes difficult to cut and can lead to issues with sticking or even detachment.

b. The distance from the outermost board to the edge must also be at least twice the thickness of the board.

c. If the PANEL size is small, following the above packaging method may result in wasted material and labor. For larger quantities, a flexible board packaging method can be adopted by creating a mold for the container and then applying the PE film to minimize packaging time. Another approach, contingent on customer approval, involves eliminating the space between each stack of boards, separating them with cardboard and adding appropriate stacks. Cardboard or corrugated paper can also be placed underneath.

C. **Starting the Process**:

A. Press to start; the heated PE film will lower via the pressure frame to cover the countertop.

B. The bottom vacuum pump will evacuate air, securing the circuit board in place with the bubble wrap.

C. Wait for cooling, then remove the heater and lift the outer frame.

D. After sealing the PE film, open the chassis to cut partitions for each stack.

D. **Packing**: If the customer specifies a packing method, it must be followed. If no specifications are provided, the factory’s packing standards should prioritize preventing damage to the boards during transportation. Special attention should be given to the previously mentioned matters, particularly for exported products.

E. **Additional Considerations**:

A. Essential information should be written on the outside of the box, such as “oral wheat head,” material number (P/N), version, date, quantity, and important details like “Made in Taiwan” (if exporting).

B. Attach relevant quality certificates, including slices, solderability statements, test records, and other required documentation, as specified by the customer. Packaging is not merely a routine task; it requires careful attention to detail to prevent avoidable issues.

2. Factors Affecting the Appearance of PCB Circuit Boards

1. **Overview**

With the rapid advancement of PCB circuit board manufacturing technology, users now demand not only the intrinsic quality of PCB circuit boards (which includes hole resistance, copper foil thickness, continuity testing, solderability, etc.), but also place higher expectations on the appearance of these boards. For instance, ink color should be uniform and free of impurities, and the copper layer must be devoid of foreign matter and oxidation points. The influence of pre-screening treatment on appearance quality will be discussed below.

The main effects of pretreatment of screen printing on PCB appearance include oxidation of copper beneath the ink and physical damage (such as noticeable scratches on the copper layer or substrate) occurring during pretreatment. Uneven ink color on the copper foil is another issue. The quality of the pretreatment directly impacts the appearance quality of the PCB circuit board, leading to potential rework, disruptions to production schedules, delays in delivery, and harm to the company’s reputation; in severe cases, it may even result in board scrapping. Ultimately, this could reduce the company’s orders and directly affect economic outcomes.

To minimize losses from pretreatment and enhance competitiveness, it’s essential to maintain strict control over the pretreatment process.

2. **Purpose and Method of Pretreatment**

The primary goal of pretreatment is to ensure the copper surface is free of oxides, grease, and impurities while maintaining a certain degree of roughness. After pretreatment, the board should undergo a cleanliness test using the Zero-Ion 100A ion concentration tester to measure impurity particle concentration. An ion concentration below 1.5 μg/cm² indicates a copper layer surface that exhibits a relatively uniform texture without oxidation points, thereby enhancing mechanical bonding with the ink and preventing blistering and large-area shedding, while also ensuring that the conductive performance of the PCB is not compromised.

There are several pretreatment methods, with the most common in the industry being: nylon brush scrubbing, chemical cleaning, alumina/pumice powder injection, alumina/pumice powder combined with nylon brush, and chemical cleaning in conjunction with nylon brush.

3. **The Pretreatment Process and Key Considerations**

Based on the specific conditions of PCB companies, extensive experiments have been conducted to refine the process flow, parameters, and operational considerations related to pretreatment. This optimization has yielded significant benefits.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me