1. COB Package on PCB Circuit Boards

The COB (Chips on Board) package on PCB circuit boards involves encapsulating the bare chip to prevent pollution or damage. Soft encapsulation, using conductive or non-conductive glue, ensures protection and functionality. COB addresses LED heat dissipation by adhering the chip to the interconnect substrate and performing wire bonding.

2. What is COB Soft Package?

COB soft package, often seen as a black component on circuit boards, is a type of hard package made of epoxy resin. It employs wire bonding in the chip production process, specifically chip-on-board packaging. This process involves mounting the chip on the PCB circuit board using epoxy resin.

3. Features of COB Soft Package

COB soft packaging is a cost-effective bare chip mounting solution, characterized by one-time molding on the circuit board’s copper foil surface. Its benefits include low cost, space efficiency, lightweight design, effective heat dissipation, and a simple packaging method. Commonly used in low-cost circuits, it involves leading out the circuit chip with metal wires, soldering, and applying glue for solidification.

4. Application Occasions

Due to its unique characteristics, COB soft packaging finds application in electronic circuits, such as MP3 players, electronic organs, digital cameras, and game consoles. Widely used beyond chips, it is also employed in LEDs, such as COB light sources, offering integrated surface light source technology attached directly to the LED chip’s mirror metal substrate.