In recent years, the consumer electronics market, particularly driven by mobile devices such as smartphones and tablets, has experienced rapid growth. This surge has been accompanied by a clear trend toward miniaturization and thinner designs. As a result, traditional printed circuit boards (PCBs) are increasingly unable to meet the evolving requirements of modern electronic products. In response, leading manufacturers have turned to new technologies that can replace conventional PCBs. Among these, Flexible Printed Circuits (FPC) have emerged as the most prominent alternative, becoming the primary connection solution in many electronic devices and accessories.
The expansion of emerging markets, including wearable smart devices and drones, has further fueled the demand for FPC products. These technologies not only create new opportunities but also enable innovative designs that were previously impossible with traditional PCB structures. Additionally, the growing prevalence of display and touch-control features in electronic products has broadened the application of FPCs. With the increasing use of small and medium-sized LCD screens and touch interfaces, FPC technology is seeing a surge in market demand.
Recent reports predict that flexible electronics will drive a multi-trillion-dollar market in the coming years. This represents a significant opportunity for countries like China to accelerate the development of their electronics industry and position themselves as global leaders in this rapidly advancing field. Flexible electronics could ultimately become a cornerstone of national industry, fostering both economic growth and technological innovation.
PCB (Printed Circuit Board) is a crucial component in nearly all electronic devices, often referred to as the “mother of electronic system products.” A subset of PCB is the FPC (Flexible Printed Circuit), commonly known as the “soft board.”
FPC is constructed from flexible substrates, typically polyimide or polyester film. Its key advantages include high wiring density, light weight, thinness, flexibility, and the ability to withstand millions of dynamic bends without damage. FPC allows for three-dimensional assembly, enabling component integration and wire connections in a way that rigid circuit boards cannot. These unique properties give FPC an edge over other types of circuit boards, especially in applications where space optimization and mechanical flexibility are critical.
FPCs can be classified based on the type of substrate film used, including PI (Polyimide), PET (Polyester), and PEN (Polyethylene Naphthalate). Among these, PI-based FPCs are the most common and are further divided into categories such as single-sided, double-sided, multi-layer, and rigid-flex FPCs. Rigid circuit boards and flexible circuit boards represent the two primary categories in PCB manufacturing. While rigid boards are predominantly used in household appliances like refrigerators, flexible circuit boards have gained significant traction in consumer electronics due to their light weight, thin profile, and flexibility, making them indispensable in devices like smartphones.
Initially, FPCs were not widely used. However, their adoption increased significantly with the large-scale integration in Apple’s products. Apple played a pivotal role in popularizing FPC technology, incorporating 14-16 FPCs in its iPhones, with approximately 70% of these being multilayered and complex. The total FPC area in an iPhone is about 120 cm². Similarly, the iPad, Apple Watch, and other Apple products also feature over 10 FPCs. This broad adoption by Apple acted as a catalyst, prompting other smartphone manufacturers like Samsung, Huawei, and HOV to follow suit. Samsung, for example, incorporates around 12-13 FPCs in its devices, with key suppliers being Korean FPC manufacturers like Interflex and SEMCO.
In the smartphone industry, the shift towards wireless charging is gaining momentum, as it eliminates the need for redundant charging cables. FPC solutions have emerged as a popular choice for wireless charging technology. Leading companies such as Samsung have adopted an integrated approach combining FPC with NFC (Near Field Communication) and MST (Magnetic Secure Transmission) technologies. The iPhone 8, for instance, is expected to introduce wireless charging, potentially utilizing Samsung’s FPC+NFC+MST integrated solution. This move is likely to spur domestic manufacturers, like HOV, to adopt similar solutions, further driving the growth of wireless charging technology. By 2019, the demand for FPCs in wireless charging modules for Apple, Samsung, and HOV could generate nearly 4 billion yuan in additional FPC production.
Since the early 2000s, the global PCB manufacturing landscape has shifted towards Asia due to factors such as labor costs, transportation efficiency, and industry supply chain dynamics. China, in particular, has seen rapid expansion in PCB production capacity, becoming the largest PCB production hub in the world by 2006.
This trend is also evident in the high-end FPC sector, where the production capacity shift continues. In 2005, China accounted for 6.74% of the global FPC output value, which grew to 47.97% by 2015. It is projected that this proportion will remain near 50% in the coming years, underscoring China’s growing dominance in the global FPC market.
In summary, FPC technology has evolved significantly, driven by its unique advantages in flexible, high-density, and space-saving design. With continued innovations and expanding adoption, especially in smartphones and wireless charging, FPC is poised to remain a critical component in the evolution of consumer electronics.
The expansion of emerging markets, including wearable smart devices and drones, has further fueled the demand for FPC products. These technologies not only create new opportunities but also enable innovative designs that were previously impossible with traditional PCB structures. Additionally, the growing prevalence of display and touch-control features in electronic products has broadened the application of FPCs. With the increasing use of small and medium-sized LCD screens and touch interfaces, FPC technology is seeing a surge in market demand.
Recent reports predict that flexible electronics will drive a multi-trillion-dollar market in the coming years. This represents a significant opportunity for countries like China to accelerate the development of their electronics industry and position themselves as global leaders in this rapidly advancing field. Flexible electronics could ultimately become a cornerstone of national industry, fostering both economic growth and technological innovation.
PCB (Printed Circuit Board) is a crucial component in nearly all electronic devices, often referred to as the “mother of electronic system products.” A subset of PCB is the FPC (Flexible Printed Circuit), commonly known as the “soft board.”
FPC is constructed from flexible substrates, typically polyimide or polyester film. Its key advantages include high wiring density, light weight, thinness, flexibility, and the ability to withstand millions of dynamic bends without damage. FPC allows for three-dimensional assembly, enabling component integration and wire connections in a way that rigid circuit boards cannot. These unique properties give FPC an edge over other types of circuit boards, especially in applications where space optimization and mechanical flexibility are critical.
FPCs can be classified based on the type of substrate film used, including PI (Polyimide), PET (Polyester), and PEN (Polyethylene Naphthalate). Among these, PI-based FPCs are the most common and are further divided into categories such as single-sided, double-sided, multi-layer, and rigid-flex FPCs. Rigid circuit boards and flexible circuit boards represent the two primary categories in PCB manufacturing. While rigid boards are predominantly used in household appliances like refrigerators, flexible circuit boards have gained significant traction in consumer electronics due to their light weight, thin profile, and flexibility, making them indispensable in devices like smartphones.
Initially, FPCs were not widely used. However, their adoption increased significantly with the large-scale integration in Apple’s products. Apple played a pivotal role in popularizing FPC technology, incorporating 14-16 FPCs in its iPhones, with approximately 70% of these being multilayered and complex. The total FPC area in an iPhone is about 120 cm². Similarly, the iPad, Apple Watch, and other Apple products also feature over 10 FPCs. This broad adoption by Apple acted as a catalyst, prompting other smartphone manufacturers like Samsung, Huawei, and HOV to follow suit. Samsung, for example, incorporates around 12-13 FPCs in its devices, with key suppliers being Korean FPC manufacturers like Interflex and SEMCO.
In the smartphone industry, the shift towards wireless charging is gaining momentum, as it eliminates the need for redundant charging cables. FPC solutions have emerged as a popular choice for wireless charging technology. Leading companies such as Samsung have adopted an integrated approach combining FPC with NFC (Near Field Communication) and MST (Magnetic Secure Transmission) technologies. The iPhone 8, for instance, is expected to introduce wireless charging, potentially utilizing Samsung’s FPC+NFC+MST integrated solution. This move is likely to spur domestic manufacturers, like HOV, to adopt similar solutions, further driving the growth of wireless charging technology. By 2019, the demand for FPCs in wireless charging modules for Apple, Samsung, and HOV could generate nearly 4 billion yuan in additional FPC production.
Since the early 2000s, the global PCB manufacturing landscape has shifted towards Asia due to factors such as labor costs, transportation efficiency, and industry supply chain dynamics. China, in particular, has seen rapid expansion in PCB production capacity, becoming the largest PCB production hub in the world by 2006.
This trend is also evident in the high-end FPC sector, where the production capacity shift continues. In 2005, China accounted for 6.74% of the global FPC output value, which grew to 47.97% by 2015. It is projected that this proportion will remain near 50% in the coming years, underscoring China’s growing dominance in the global FPC market.
In summary, FPC technology has evolved significantly, driven by its unique advantages in flexible, high-density, and space-saving design. With continued innovations and expanding adoption, especially in smartphones and wireless charging, FPC is poised to remain a critical component in the evolution of consumer electronics.
