1. With the advancement of electronic products towards higher density and precision, the demand for circuit boards has likewise escalated, propelling their gradual evolution towards High-Density Interconnect (HDI) technology.
2. One of the most efficient methods to enhance PCB density involves minimizing the quantity of through-holes while precisely implementing blind and buried vias.
1. Note that the laser hole may or may not be sleeved with the inner buried hole, and whether the holes of the two drill belts are aligned.
2. In an ordinary multi-layer PCB circuit board, the inner layers are not drilled.
3. All tooling holes must be drilled. Special attention should be paid to rivets GH, which need to protrude to prevent misalignment (AOIGH is also die-cut). Additionally, the edge of the panel board needs to be drilled to distinguish each board.
4. Note that the film is produced in positive and negative formats.
2. One of the most efficient methods to enhance PCB density involves minimizing the quantity of through-holes while precisely implementing blind and buried vias.
1. Note that the laser hole may or may not be sleeved with the inner buried hole, and whether the holes of the two drill belts are aligned.
2. In an ordinary multi-layer PCB circuit board, the inner layers are not drilled.
3. All tooling holes must be drilled. Special attention should be paid to rivets GH, which need to protrude to prevent misalignment (AOIGH is also die-cut). Additionally, the edge of the panel board needs to be drilled to distinguish each board.
4. Note that the film is produced in positive and negative formats.
