Advancements in PCB Technology: Embracing High-Density Interconnect (HDI)
As electronic products continue to push boundaries in density and precision, the demand for circuit boards has surged. This trend has catalyzed the shift towards High-Density Interconnect (HDI) technology, marking a significant evolution in PCB fabrication.
Enhancing PCB Density with Advanced Techniques
One effective strategy to boost PCB density involves reducing the number of through-holes while integrating blind and buried vias with precision. By minimizing these elements, PCBs can achieve higher levels of complexity and functionality.
Key Considerations in PCB Fabrication
- Not all laser holes are sleeved with inner buried holes, emphasizing the importance of alignment.
- In multi-layer PCBs, inner layers typically remain unperforated.
- Tooling holes, especially rivets GH, play a crucial role in preventing misalignment and should protrude adequately.
- Both positive and negative film formats are utilized in the production process.
Ensuring meticulous attention to detail in drilling tooling holes and maintaining alignment integrity are essential steps in the fabrication of modern PCBs. Embracing HDI technology opens up new possibilities for creating intricate circuit boards that meet the demands of cutting-edge electronic devices.
