PCB Board Manufacturing Processes

1. Double-sided Spray Tin Plate PCB Board:

• Cutting material
• Baking board
• Drilling
• Copper sinking
• Pattern transfer
• Electric copper, tin
• Etching
• Tin stripping
• Light board test
• Etching QC
• Photosensitive green oil
• Silk screen characters
• Tin spraying
• Punching board or gong board
• V-CUT
• Finished product testing
• FQC
• FQA
• Packing and shipping

2. Double-sided Spray Tin Gold Finger PCB Board:

• Cutting material
• Baking board
• Drilling
• Copper sinking
• Circuit
• Electric copper, tin
• Etching
• Tin stripping
• Etching QC
• Photosensitive green oil
• Silk screen characters
• Electric gold finger
• Tin spraying
• Punching board or gong board
• V-CUT
• Gold finger beveled edge
• Finished product testing
• FQC
• FQA
• Packing and shipping

3. Double-sided Immersion Gold (Gold) Plate PCB Board:

• Cutting material
• Baking board
• Drilling
• Copper sinking
• One full board electroplating
• Photosensitive circuit
• Electric copper, tin
• Etching
• Stripping tin
• Light board test
• Etching QC
• Photosensitive green oil
• Silk screen characters
• Immersion gold (chemical gold)
• Punching plate or gong plate
• V-CUT
• Finished product testing
• FQC
• FQA
• Packaging and shipping

4. Double-sided Immersion Silver and Immersion Tin Plate PCB Board:

• Cutting material
• Baking board
• Drilling
• Copper sinking
• Photosensitive circuit
• Electric copper, tin
• Etching
• Tin stripping
• Light board test
• Etching QC
• Photosensitive green oil
• Silk screen characters
• Punching board or gong board
• V-CUT
• Finished product testing
• Immersion silver (immersion tin)
• FQC
• FQA
• Packaging and shipping

5. Double-sided Anti-Oxidation Board (OSP) PCB Board:

• Cutting material
• Baking plate
• Drilling
• Copper sinking
• Photosensitive circuit
• Copper plating, tin
• Etching
• Tin stripping
• Light plate test
• Etching QC
• Photosensitive green oil
• Silk screen characters
• Punching board or gong board
• V-CUT
• Finished product test
• Anti-oxidation (OSP)
• FQC
• FQA
• Packing and shipping

6. Multilayer Board:

• Cutting material
• Baking board
• Inner layer circuit
• Inner layer etching
• Etching QC
• Inner layer AOI
• Browning or blackening
• Pressing
• Drilling
• Removing glue residue
• Sinking copper
• (The subsequent process is the same as that of the double-sided panel)