7. Double-sided spray tin plate of PCB board: Cutting material → baking board → drilling → copper sinking → pattern transfer → electric copper, tin → etching → tin stripping → light board test → etching QC → photosensitive green oil → silk screen characters → Tin spraying → punching board or gong board → V-CUT → finished product testing → FQC → FQA → packing and shipping
8. Double-sided spray tin gold finger board: Cutting material → baking board → drilling → copper sinking → circuit → electric copper, tin → etching → tin stripping → etching QC → photosensitive green oil → silk screen characters → electric gold finger → Tin spraying → punching board or gong board → V-CUT → gold finger beveled edge → finished product testing → FQC → FQA → packing and shipping
9. Double-sided immersion gold (gold) plate: Cutting material → baking board → drilling → copper sinking → one full board electroplating → photosensitive circuit → electric copper, tin → etching → stripping tin → light board test → etching QC → photosensitive green oil → silk screen characters → immersion gold (chemical gold) → Punching plate or gong plate → V-CUT → finished product testing → FQC → FQA → packaging and shipping
10. Double-sided immersion silver and immersion tin plate: Cutting material → baking board → drilling → copper sinking → photosensitive circuit → electric copper, tin → etching → tin stripping → light board test → etching QC → photosensitive green oil → silk screen characters → Punching board or gong board → V-CUT → finished product testing → immersion silver (immersion tin) → FQC → FQA → packaging and shipping
11. Double-sided anti-oxidation board (OSP): Cutting material → baking plate → drilling → copper sinking → photosensitive circuit → copper plating, tin → etching → tin stripping → light plate test → etching QC → photosensitive green oil → silk screen characters → Punching board or gong board → V-CUT → finished product test → anti-oxidation (OSP) → FQC → FQA → packing and shipping
12. Multilayer board: Cutting material → baking board → inner layer circuit → inner layer etching → etching QC → inner layer AOI → browning or blackening → pressing → drilling → removing glue residue → sinking copper (The subsequent process is the same as that of the double-sided panel)
8. Double-sided spray tin gold finger board: Cutting material → baking board → drilling → copper sinking → circuit → electric copper, tin → etching → tin stripping → etching QC → photosensitive green oil → silk screen characters → electric gold finger → Tin spraying → punching board or gong board → V-CUT → gold finger beveled edge → finished product testing → FQC → FQA → packing and shipping
9. Double-sided immersion gold (gold) plate: Cutting material → baking board → drilling → copper sinking → one full board electroplating → photosensitive circuit → electric copper, tin → etching → stripping tin → light board test → etching QC → photosensitive green oil → silk screen characters → immersion gold (chemical gold) → Punching plate or gong plate → V-CUT → finished product testing → FQC → FQA → packaging and shipping
10. Double-sided immersion silver and immersion tin plate: Cutting material → baking board → drilling → copper sinking → photosensitive circuit → electric copper, tin → etching → tin stripping → light board test → etching QC → photosensitive green oil → silk screen characters → Punching board or gong board → V-CUT → finished product testing → immersion silver (immersion tin) → FQC → FQA → packaging and shipping
11. Double-sided anti-oxidation board (OSP): Cutting material → baking plate → drilling → copper sinking → photosensitive circuit → copper plating, tin → etching → tin stripping → light plate test → etching QC → photosensitive green oil → silk screen characters → Punching board or gong board → V-CUT → finished product test → anti-oxidation (OSP) → FQC → FQA → packing and shipping
12. Multilayer board: Cutting material → baking board → inner layer circuit → inner layer etching → etching QC → inner layer AOI → browning or blackening → pressing → drilling → removing glue residue → sinking copper (The subsequent process is the same as that of the double-sided panel)
