Types of PCB Boards and Manufacturing Processes

• Double-Sided Spray Tin Plate PCB Board

  The manufacturing process includes cutting material, baking board, drilling, copper sinking, pattern transfer, electric copper, tin, etching, tin stripping, light board test, etching QC, photosensitive green oil, silk screen characters, tin spraying, punching board or gong board, V-CUT, finished product testing, FQC, FQA, packing, and shipping.

• Double-Sided Spray Tin Gold Finger Board

  The process involves cutting material, baking board, drilling, copper sinking, circuit creation, electric copper, tin, etching, tin stripping, etching QC, photosensitive green oil, silk screen characters, electric gold finger, tin spraying, punching board or gong board, V-CUT, gold finger beveled edge, finished product testing, FQC, FQA, packing, and shipping.

• Double-Sided Immersion Gold (Gold) Plate

  Steps include cutting material, baking board, drilling, copper sinking, full board electroplating, photosensitive circuit creation, electric copper, tin, etching, tin stripping, light board test, etching QC, photosensitive green oil, silk screen characters, immersion gold (chemical gold), punching plate or gong plate, V-CUT, finished product testing, FQC, FQA, packaging, and shipping.

• Double-Sided Immersion Silver and Immersion Tin Plate

  The process comprises cutting material, baking board, drilling, copper sinking, photosensitive circuit creation, electric copper, tin, etching, tin stripping, light board test, etching QC, photosensitive green oil, silk screen characters, punching board or gong board, V-CUT, finished product testing, immersion silver (immersion tin), FQC, FQA, packaging, and shipping.

• Double-Sided Anti-Oxidation Board (OSP)

  Manufacturing involves cutting material, baking plate, drilling, copper sinking, photosensitive circuit creation, copper plating, tin, etching, tin stripping, light plate test, etching QC, photosensitive green oil, silk screen characters, punching board or gong board, V-CUT, finished product testing, anti-oxidation (OSP), FQC, FQA, packing, and shipping.

• Multilayer Board

  The process includes cutting material, baking board, inner layer circuit creation, inner layer etching, etching QC, inner layer AOI, browning or blackening, pressing, drilling, glue residue removal, copper sinking. Subsequent processes are the same as those of the double-sided panel.