Via in Pad Process

1. Definition:

• The traditional method of producing PCB boards involves drilling through holes and plating copper to establish conductivity between layers. A wire is then connected to a pad for soldering external components.

2. Development:

• Modern circuit boards are evolving towards higher densities and interconnections, leading to limited space for traditional through-hole wires and pads. The Via in Pad process has emerged to address this challenge.

3. Function:

• The Via in Pad process makes circuit board production three-dimensional, conserving horizontal space and meeting the demands of high-density and interconnected modern circuit boards.

Traditional Resin Plugging Process

1. Definition:

• The resin plugging process involves filling buried holes with resin and pressure bonding, commonly used in high-frequency and HDI boards. It includes traditional silk screen resin plug holes and vacuum resin plug holes.

2. Process:

• Drilling resin hole, electroplating, resin plug hole, ceramic grinding plate, drilling through hole, electroplating, post-process.

3. Post-process requirements:

• (a) Each board must be ground horizontally and vertically to ensure thorough cleaning of the resin on the board’s surface. Partially cleaned resin can be manually polished for repair.
• (b) The depression in resin after grinding the board should not exceed 0.075mm.

4. Electroplating requirements:

• Electroplating is done according to customer specifications for copper thickness. Slicing is then performed to confirm the recession of the resin plug hole.

Vacuum Resin Plugging Process

1. Definition:

• The vacuum silk screen plugging machine is specialized equipment for the PCB industry, suitable for various types of resin plug holes. It ensures the absence of air bubbles during the plugging process.

2. The Difference:

• The vacuum plugging process is similar to traditional screen printing plugging but operates within a vacuum environment to minimize defects like bubbles.

3. Production Process:

• Aluminum sheet, open oil, vacuum ink, install screen pad, align, vacuum equipment, test printing, inspection, mass production, segment curing, ceramic grinding plate.

Latest News: The PCB industry is witnessing advancements in additive manufacturing techniques, allowing for the production of more complex and compact circuit boards. These innovations are enabling faster prototyping and enhanced functionality in electronic devices.