PCB screen printing technology has many specifications that must be followed diligently. These specifications have played a crucial role in driving the advancement of PCB screen printing technology. Let’s delve into the details of these specifications.
1. All components, mounting holes, and positioning holes must have corresponding silk-screen markings to aid in the installation process. The mounting holes on the PCB should be identified using H1, H2…Hn markings.
2. Silk-screen characters should be arranged from left to right and bottom-up wherever possible. For components with polarities like electrolytic capacitors and diodes, it is important to maintain a consistent direction within each functional unit.
3. Avoid applying silkscreen on device pads, tin tracks requiring tinning, and areas where devices will be placed after installation. However, high-density PCBs that do not require silk screen printing are an exception.
4. To ensure the soldering reliability of devices, avoid applying silkscreen on device pads. Similarly, for the continuity of tin channels, avoid applying silkscreen on them. Care should be taken to not place silkscreen over vias and pads to prevent loss during solder mask opening, which could impact functionality. The spacing between silkscreen elements should be at least 5 mils.
5. Clearly indicate the polarity of polarized components on the silkscreen to facilitate identification.
6. The PCB light drawing files should be accurate, with each layer displaying correct output. It is vital to ensure that the number of layers is fully outputted.
7. The identification of devices on the PCB must match the symbols listed in the BOM.
8. Clearly indicate the direction of directional connectors on the silkscreen.
9. Include a barcode position marker on the PCB. If space allows, incorporate a 42*6 barcode silkscreen frame on the PCB for easy scanning.
10. Ensure that the silk-screened board name, date, version number, and other relevant information on the finished board are clearly legible. The PCB file should also contain this information in a prominent and visible location.
11. Include relevant manufacturer information and anti-static signs on the PCB to meet industry standards and regulations.
1. All components, mounting holes, and positioning holes must have corresponding silk-screen markings to aid in the installation process. The mounting holes on the PCB should be identified using H1, H2…Hn markings.
2. Silk-screen characters should be arranged from left to right and bottom-up wherever possible. For components with polarities like electrolytic capacitors and diodes, it is important to maintain a consistent direction within each functional unit.
3. Avoid applying silkscreen on device pads, tin tracks requiring tinning, and areas where devices will be placed after installation. However, high-density PCBs that do not require silk screen printing are an exception.
4. To ensure the soldering reliability of devices, avoid applying silkscreen on device pads. Similarly, for the continuity of tin channels, avoid applying silkscreen on them. Care should be taken to not place silkscreen over vias and pads to prevent loss during solder mask opening, which could impact functionality. The spacing between silkscreen elements should be at least 5 mils.
5. Clearly indicate the polarity of polarized components on the silkscreen to facilitate identification.
6. The PCB light drawing files should be accurate, with each layer displaying correct output. It is vital to ensure that the number of layers is fully outputted.
7. The identification of devices on the PCB must match the symbols listed in the BOM.
8. Clearly indicate the direction of directional connectors on the silkscreen.
9. Include a barcode position marker on the PCB. If space allows, incorporate a 42*6 barcode silkscreen frame on the PCB for easy scanning.
10. Ensure that the silk-screened board name, date, version number, and other relevant information on the finished board are clearly legible. The PCB file should also contain this information in a prominent and visible location.
11. Include relevant manufacturer information and anti-static signs on the PCB to meet industry standards and regulations.
