1. PCB splitter, also known as a circuit board splitter, is widely used in the manufacturing of electronic PCB products.
2. Initially, manual splitting machines were employed, but these were inefficient and caused significant damage to the substrate. Some boards even had components inserted, leading to further complications. Consequently, mechanized methods have replaced this older approach.
3. With advancements in science and technology, PCB splitting methods are becoming increasingly intelligent, efficient, and precise. Naturally, this has led to higher costs and greater demands from customers. To excel in the modern production environment, PCB sub-board processing companies must adapt to these evolving requirements.
Here’s a refined version of the text with the line numbers and content preserved:
1. The common PCB splitters include laser splitters, curve splitters, knife splitters, guillotine splitters, stamping splitters, hand-push splitters, and milling cutter splitters.
2. Laser splitters are an emerging technology. As laser technology advances, its applications in electronic manufacturing are expanding, and its use in PCB splitting is a notable example.
3. Depending on the requirements, different types of lasers are employed. Currently, UV lasers, CO2 lasers, green lasers, and picosecond lasers are available, each varying in price. In terms of overall cost-effectiveness, UV lasers and green lasers are the most commonly used.
4. The thickness of the PCB that can be processed by an ultraviolet laser cutting machine is relatively low, generally not exceeding 1mm. Green lasers, on the other hand, are typically high-power and can handle PCBs thicker than 1mm.
5. The primary advantages of laser splitters are their cutting efficiency and quality. The cuts are precise with no carbonization or burrs, and the machines are dust-free and smoke-free due to their adsorption capabilities. The non-contact processing method minimizes thermal impact, avoiding damage to the substrate or active devices, and ensures stress-free operation. With CCD positioning and computer-controlled automatic cutting, these machines can also handle automatic loading and unloading, maximizing production efficiency and reducing labor costs.
6. However, laser splitters have notable drawbacks, including their high cost. As of September 2016, the price of a UV laser PCB splitter from Top Yin Optoelectronics ranged from 400,000 to 800,000, depending on the accessories and laser power. This represents a significant initial investment, though Top Yin Optoelectronics does offer installment payment options to ease the financial burden.
7. In contrast, curve splitters, knife splitters, guillotine splitters, stamping splitters, hand-push splitters, and milling cutter splitters have their own limitations. They all use contact processing methods, which can cause stress and damage to the substrate. These methods often result in burrs on the cut edges and generate considerable dust, which is less favorable for sustainability and environmental considerations.
8. While the initial cost of these alternative models is relatively lower, choosing the most suitable equipment depends on specific needs. For small-scale production, less expensive equipment may suffice, allowing for gradual processing. However, for high-quality and mass production, a laser splitter might be a better investment.
2. Initially, manual splitting machines were employed, but these were inefficient and caused significant damage to the substrate. Some boards even had components inserted, leading to further complications. Consequently, mechanized methods have replaced this older approach.
3. With advancements in science and technology, PCB splitting methods are becoming increasingly intelligent, efficient, and precise. Naturally, this has led to higher costs and greater demands from customers. To excel in the modern production environment, PCB sub-board processing companies must adapt to these evolving requirements.
Here’s a refined version of the text with the line numbers and content preserved:
1. The common PCB splitters include laser splitters, curve splitters, knife splitters, guillotine splitters, stamping splitters, hand-push splitters, and milling cutter splitters.
2. Laser splitters are an emerging technology. As laser technology advances, its applications in electronic manufacturing are expanding, and its use in PCB splitting is a notable example.
3. Depending on the requirements, different types of lasers are employed. Currently, UV lasers, CO2 lasers, green lasers, and picosecond lasers are available, each varying in price. In terms of overall cost-effectiveness, UV lasers and green lasers are the most commonly used.
4. The thickness of the PCB that can be processed by an ultraviolet laser cutting machine is relatively low, generally not exceeding 1mm. Green lasers, on the other hand, are typically high-power and can handle PCBs thicker than 1mm.
5. The primary advantages of laser splitters are their cutting efficiency and quality. The cuts are precise with no carbonization or burrs, and the machines are dust-free and smoke-free due to their adsorption capabilities. The non-contact processing method minimizes thermal impact, avoiding damage to the substrate or active devices, and ensures stress-free operation. With CCD positioning and computer-controlled automatic cutting, these machines can also handle automatic loading and unloading, maximizing production efficiency and reducing labor costs.
6. However, laser splitters have notable drawbacks, including their high cost. As of September 2016, the price of a UV laser PCB splitter from Top Yin Optoelectronics ranged from 400,000 to 800,000, depending on the accessories and laser power. This represents a significant initial investment, though Top Yin Optoelectronics does offer installment payment options to ease the financial burden.
7. In contrast, curve splitters, knife splitters, guillotine splitters, stamping splitters, hand-push splitters, and milling cutter splitters have their own limitations. They all use contact processing methods, which can cause stress and damage to the substrate. These methods often result in burrs on the cut edges and generate considerable dust, which is less favorable for sustainability and environmental considerations.
8. While the initial cost of these alternative models is relatively lower, choosing the most suitable equipment depends on specific needs. For small-scale production, less expensive equipment may suffice, allowing for gradual processing. However, for high-quality and mass production, a laser splitter might be a better investment.
