For electronic equipment, work will produce a certain amount of heat, causing the internal temperature to rise rapidly. If the heat is not released in time, the equipment will continue to heat up, leading to device failure due to overheating and a decline in reliable performance. Therefore, carrying out effective heat dissipation treatment on the circuit board is crucial.
PCB design is a crucial process following principle design, as the quality of the design directly affects product performance and marketing cycle. Devices on the PCB board have their own working environment temperature range, and if this range is exceeded, their efficiency will be greatly reduced or they may fail, leading to device damage. Therefore, heat dissipation is a critical consideration in PCB design.
As a PCB design engineer, how should one carry out heat dissipation treatment?
PCB heat dissipation and plate selection, as well as the selection of components and component layout, are all related aspects. Among them, the layout of PCB heat dissipation plays a decisive role and is the key link in PCB heat dissipation design. Engineers need to consider the following aspects when making the layout:
(1) Design and install components with high heat and radiation centrally on a separate PCB board to carry out separate centralized ventilation and cooling to avoid mutual interference with the main board.
(2) Distribute the heat capacity on the PCB surface evenly, avoiding concentration of high-power devices. If unavoidable, place shorter components in the upstream of the airflow and ensure enough cooling airflow through the area of heat consumption concentration.
(3) Keep the heat transfer path as short as possible.
(4) Ensure the heat transfer cross-section is as large as possible.
(5) Take into account the influence of thermal radiation on surrounding parts in the layout of components. Keep heat-sensitive components and components (including semiconductor devices) away from heat or isolated.
(6) Pay attention to the direction of forced ventilation and natural ventilation.
(7) Ensure the air duct of the additional sub-plate and the device is consistent with the ventilation direction.
(8) Allow enough distance between the intake and exhaust as much as possible.
(9) Place the heating device above the product as much as possible and on the airflow path when conditions permit.
(10) Avoid placing components with large heat or current in the corners and edges of the PCB board. Install radiators as far as possible and keep them away from other devices, ensuring the heat dissipation channel is unobstructed.
1. Reminder: Adding a radiator to the device is also a good way to dissipate heat.
PCB design is a crucial process following principle design, as the quality of the design directly affects product performance and marketing cycle. Devices on the PCB board have their own working environment temperature range, and if this range is exceeded, their efficiency will be greatly reduced or they may fail, leading to device damage. Therefore, heat dissipation is a critical consideration in PCB design.
As a PCB design engineer, how should one carry out heat dissipation treatment?
PCB heat dissipation and plate selection, as well as the selection of components and component layout, are all related aspects. Among them, the layout of PCB heat dissipation plays a decisive role and is the key link in PCB heat dissipation design. Engineers need to consider the following aspects when making the layout:
(1) Design and install components with high heat and radiation centrally on a separate PCB board to carry out separate centralized ventilation and cooling to avoid mutual interference with the main board.
(2) Distribute the heat capacity on the PCB surface evenly, avoiding concentration of high-power devices. If unavoidable, place shorter components in the upstream of the airflow and ensure enough cooling airflow through the area of heat consumption concentration.
(3) Keep the heat transfer path as short as possible.
(4) Ensure the heat transfer cross-section is as large as possible.
(5) Take into account the influence of thermal radiation on surrounding parts in the layout of components. Keep heat-sensitive components and components (including semiconductor devices) away from heat or isolated.
(6) Pay attention to the direction of forced ventilation and natural ventilation.
(7) Ensure the air duct of the additional sub-plate and the device is consistent with the ventilation direction.
(8) Allow enough distance between the intake and exhaust as much as possible.
(9) Place the heating device above the product as much as possible and on the airflow path when conditions permit.
(10) Avoid placing components with large heat or current in the corners and edges of the PCB board. Install radiators as far as possible and keep them away from other devices, ensuring the heat dissipation channel is unobstructed.
1. Reminder: Adding a radiator to the device is also a good way to dissipate heat.
