The issues of false soldering and inadequate soldering in PCBA processing not only pose significant quality risks to products but also negatively impact customers, severely affecting the company’s reputation, reducing production efficiency, and increasing costs. The following methods and measures will be outlined to prevent false soldering and inadequate soldering during PCBA production.
1. Explanation of PCBA processing problems
1. What is inadequate soldering: Inadequate soldering refers to minimal solder adhesion at the joints, occasionally leading to open circuits. This results in poor contact between components and pads, significantly diminishing the reliability of multilayer PCBs.
2. What is false soldering:
False soldering is akin to virtual soldering; it refers to the phenomenon where a circuit functions normally initially, but an open circuit gradually develops over time.
3. Processes involved:
PCB multilayer board soldering, wiring, and debugging.
4. Hazards of false soldering:
The presence of false soldering significantly diminishes the reliability of the PCB multilayer board and the overall product. This results in unnecessary maintenance during production, elevating costs and reducing efficiency, while also introducing substantial quality and safety risks for shipped products, which increases after-sales maintenance expenses.
2. Reducing PCBA processing issues and preventive measures:
1. Focus on the soldering process:
1.1. Electric soldering iron: Ensure the soldering iron tip is clean, smooth, and free of oxidation. If an oxide layer is present, wipe the tip on a high-temperature sponge before use. The soldering iron’s temperature must be maintained within the appropriate range; excessive heat or low temperatures can lead to poor soldering. Typically, temperatures should be around 300 to 360 degrees, with soldering times under 5 seconds. Select electric soldering irons based on the size of components and soldering points.
1.2. Solder wire: Use high-quality solder wire (63% tin, 37% lead) in appropriate amounts. Ensure solder joints are adequately wetted by the pads, including via holes.
1.3. Other materials and tools: Use flux properly, verify that welding auxiliary equipment is functioning correctly, and follow operating instructions and precautions. Maintain equipment promptly after use (e.g., semi-auto immersion tin machine, crimping tool).
1.4. Before soldering, check for oxidation on device pins, wires, soldering pieces, or transformer pins. For oxidized components, remove the oxide layer prior to soldering to prevent false soldering. Ensure welding materials and the environment are clean to avoid stains and dust that could hinder quality.
2. Rigorously adhere to relevant process regulations, maximizing the roles of self-inspection, mutual inspection, and quality checks during production, enhancing inspection pass rates with essential tools and equipment.
3. Relevant departments should conduct targeted training to enhance skills and knowledge, clarifying the hazards of the aforementioned issues to boost production employees’ sense of responsibility. Utilize necessary documentation to ensure production accuracy and reliability.
4. The Quality Control Department must intensify inspections of related issues and implement a rewards and penalties system based on the existing “Quality Assessment System” for significant problems.
Ultimately, the issues of false soldering stem from employees’ sense of responsibility and operational skills. Employees must cultivate product quality awareness, enhance responsibility, and improve skills across components, tools, and systems to minimize and prevent false soldering occurrences.
PCBA processing and production quality control are crucial. Outstanding product quality and a positive service attitude provide numerous customers in China with high-quality PCBA processing services.
1. Explanation of PCBA processing problems
1. What is inadequate soldering: Inadequate soldering refers to minimal solder adhesion at the joints, occasionally leading to open circuits. This results in poor contact between components and pads, significantly diminishing the reliability of multilayer PCBs.
2. What is false soldering:
False soldering is akin to virtual soldering; it refers to the phenomenon where a circuit functions normally initially, but an open circuit gradually develops over time.
3. Processes involved:
PCB multilayer board soldering, wiring, and debugging.
4. Hazards of false soldering:
The presence of false soldering significantly diminishes the reliability of the PCB multilayer board and the overall product. This results in unnecessary maintenance during production, elevating costs and reducing efficiency, while also introducing substantial quality and safety risks for shipped products, which increases after-sales maintenance expenses.
2. Reducing PCBA processing issues and preventive measures:
1. Focus on the soldering process:
1.1. Electric soldering iron: Ensure the soldering iron tip is clean, smooth, and free of oxidation. If an oxide layer is present, wipe the tip on a high-temperature sponge before use. The soldering iron’s temperature must be maintained within the appropriate range; excessive heat or low temperatures can lead to poor soldering. Typically, temperatures should be around 300 to 360 degrees, with soldering times under 5 seconds. Select electric soldering irons based on the size of components and soldering points.
1.2. Solder wire: Use high-quality solder wire (63% tin, 37% lead) in appropriate amounts. Ensure solder joints are adequately wetted by the pads, including via holes.
1.3. Other materials and tools: Use flux properly, verify that welding auxiliary equipment is functioning correctly, and follow operating instructions and precautions. Maintain equipment promptly after use (e.g., semi-auto immersion tin machine, crimping tool).
1.4. Before soldering, check for oxidation on device pins, wires, soldering pieces, or transformer pins. For oxidized components, remove the oxide layer prior to soldering to prevent false soldering. Ensure welding materials and the environment are clean to avoid stains and dust that could hinder quality.
2. Rigorously adhere to relevant process regulations, maximizing the roles of self-inspection, mutual inspection, and quality checks during production, enhancing inspection pass rates with essential tools and equipment.
3. Relevant departments should conduct targeted training to enhance skills and knowledge, clarifying the hazards of the aforementioned issues to boost production employees’ sense of responsibility. Utilize necessary documentation to ensure production accuracy and reliability.
4. The Quality Control Department must intensify inspections of related issues and implement a rewards and penalties system based on the existing “Quality Assessment System” for significant problems.
Ultimately, the issues of false soldering stem from employees’ sense of responsibility and operational skills. Employees must cultivate product quality awareness, enhance responsibility, and improve skills across components, tools, and systems to minimize and prevent false soldering occurrences.
PCBA processing and production quality control are crucial. Outstanding product quality and a positive service attitude provide numerous customers in China with high-quality PCBA processing services.
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