2. Most R&D teams have adopted [Strain gage] as a key design reference indicator, although many still focus primarily on verifying process stress.
3. My next goal is to implement [Strain gauge] measurements during DQ tumble tests and drop tests.
4. The aim is to assess the extent of bending strain on the internal circuit board resulting from impacts during rolling and drop tests—this is crucial for R&D to validate design parameters.
5. Without this verification, even if PCB manufacturers strive to minimize strain during assembly, the products could fail as soon as they reach customers.
6. Such failures could lead to a dismal market reception for these products!
7. I aim to advance [Strain gage] measurement in research and development, driven by Shenzhen Grand Power’s interests.
8. Each time R&D faces BGA solder ball cracking issues, the immediate response is to consult the department about enhancing solder strength to prevent such cracks.
1. Regardless of how painful the explanation may be, and no matter how robust the solder strength, it cannot be enhanced to completely withstand the stress caused by board bending during product falls. This raises the question: is the notion of “electronic parts falling or solder cracking being a myth in the SMT process?”
2. Ultimately, I was able to develop and design a shielding can that is integrally formed and directly welded to the circuit board. The aim was to enhance the board’s rigidity to resist the bending issues caused by impact stress, while also ensuring that the welding of the shielding cover does not extend to the edge of the soldering pad; otherwise, an effective solder arc (fillet) cannot be formed along the edge of the shielding frame. Additionally, the shielding cover is not permitted to serve as a positioning pin.
3. It is challenging to produce and maintain the shielding cover directly on the circuit board. Notably, the statement “the shielding cover is not allowed to shift to the edge of the soldering pad” has led to significant pushback from the SMT factory, as the current equipment cannot effectively check the shielding alignment 100%.
4. The PCB engineer was tasked with personally measuring the offset of several shielding cases under an optical microscope, and also creating slices to examine the fillet shape both inside and outside the shielding case.
5. For this reason, we specifically requested the PCB engineer to personally assess the offset of multiple shielding covers using an optical microscope and to make slices to inspect the fillet shape on both the interior and exterior of the shielding cover.
