In the electronics industry, PCBA processing utilizes both wave soldering and manual soldering for software materials. What are the distinctions between these two methods, and what are their respective advantages and disadvantages?

1. The quality and efficiency of the soldering process can be quite low.

1. While the use of high-quality intelligent electric soldering irons like ERSA, OK, HAKKO, and Quick has enhanced soldering quality, several factors remain challenging to manage. For instance, controlling the amount of solder in the joints, the wetting angle, and maintaining consistent soldering can be difficult. Additionally, there are specific requirements for the tin-through rate of metallized holes. This becomes particularly cumbersome when dealing with gold-plated component leads, as removing the gold and enamel tin from the areas to be soldered is a complex task.


2. Manual soldering involves human factors and various drawbacks, making it challenging to meet stringent quality standards. For instance, as the density and thickness of circuit boards increase, the heat capacity during soldering also rises, which can lead to insufficient heat from soldering irons. Consequently, the solder joint height or through-hole solder may not meet required specifications. If the soldering temperature is excessively raised or the soldering duration is extended, there’s a risk of damaging the printed circuit board, potentially resulting in pad detachment.

3. Traditional manual soldering relies heavily on a large workforce performing point-to-point connections on the PCBA. In contrast, selective wave soldering employs a method that first applies flux, then preheats the circuit board and flux, followed by soldering with a nozzle. This approach is aligned with an industrialized assembly line for batch production. Various sizes of soldering nozzles can be utilized for efficient drag soldering, often yielding welding efficiencies that are dozens of times greater than those achieved through manual methods.

Second, the high quality of wave soldering

1. During wave soldering, the parameters for each solder joint can be precisely “customized,” allowing ample room for process adjustments. Factors such as flux application amount, soldering duration, and wave height can be fine-tuned for optimal results. This careful calibration can significantly lower defect rates, and it is even possible to achieve zero-defect soldering for through-hole components. When compared to manual soldering, through-hole reflow soldering, and traditional wave soldering, selective wave soldering boasts the lowest defect per million (DPM) rate.

2. Wave soldering utilizes a programmable and movable small tin cylinder along with various adaptable soldering nozzles. This allows for programming that can circumvent specific screws and stiffeners on the B side of the PCB during soldering. This method mitigates damage from contact with high-temperature solder, eliminating the need for custom soldering trays and similar solutions.

3. A comparison between wave soldering and manual soldering reveals numerous advantages for wave soldering, including superior soldering quality, enhanced efficiency, greater flexibility, reduced defect rates, lower pollution, and compatibility with a diverse range of soldering components.

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