Common PCB Quality Issues During Manufacturing

• Soldering Problems

  Symptom: Blasting holes or cold soldering points

  Reflection Method: Analyze holes before and after soldering to identify copper stress centers

  Reasons:

  • Poor copper plating leading to holes or blasting in metalized holes
  • Trapped volatilized materials during wet processing

  Treatment Method: Minimize copper stress and collaborate with laminate manufacturers

  

• Adhesive Strength Issue

  Symptom: Pad separation from the conductor during immersion welding

  Introspection Method: Thorough testing during incoming inspection

  Cause of the Problem:

  • Electroplating solution or solvent etching
  • Improper soldering techniques during wave soldering
  • Poor laminate bonding or low thermal peel strength

  Treatment Method: Provide detailed information to laminate manufacturers and strictly follow machining procedures

  

• Excessive Size Change Issue

  Symptom: Substrate size exceeds tolerance after processing

  Reflection Method: Halt quality control during processing phase

  Reasons:

  • Overlooking structural texture direction of paper-based materials
  • Incomplete release of stress in the laminate

  Treatment Method: Cut boards opposite to structural texture direction and consult laminate manufacturers for stress release methods