Matters to Consider When Baking SMD Components

When baking SMD components like SOP, SOJ, PLCC, and QFP packed in plastic tubes, it is crucial to note that the packaging tube is not heat resistant. To avoid damage, place the components in a metal tube or tray before baking. For QFP components, there are two types of packaging plastic trays: high temperature resistant and non-high temperature resistant. The high temperature resistant trays, with Tmax ranging from 135°C to 180°C, can be safely baked in the oven. For trays not resistant to high temperatures, use a metal pan for baking to prevent accidents and ensure the pins remain undamaged during transfer.

Guidelines for Handling SMT Components

When handling SMT components during transportation, material separation, inspection, or manual mounting, it is essential for staff members to wear an anti-static wrist strap and use a suction pen for operations. Special attention should be given to avoid bumping the pins of SOP, QFP, and other devices to prevent pin warping and deformation.

Proper Storage of Unused SMD Components

As a leading FPC soft board manufacturer, WellCircuits Limited values its collaboration with many clients. Our team is dedicated to assisting both existing and new customers. If you have any inquiries, please do not hesitate to reach out to us at any time.