Efficient Preparation for SMT Chip Processing Manufacturing

From prototype to mass production stage, thorough preparation is essential for smooth material handling and minimizing delays caused by material shortages in SMT chip processing. WellCircuits Limited outlines the necessary steps for effective preparation:

I. Project Preparation

• Arrange preparation tasks four hours in advance upon receiving the order.
• Test the order immediately after SMT production and complete the first product test on the same day.
• Provide temporary operation plans one hour before production for defective products.

II. Production Process

SMT Chip Processing:

• Arrange material receiving and preparation tasks four hours in advance according to the order plan.
• Confirm the completeness of stencils, jigs, and data two hours before production begins.
• Contact material officer immediately in case of shortages.
• Report defects in visual inspection promptly for analysis and corrective action.

DIP Plug-in Handling:

• Assemble the first part and confirm quality four hours before the planned order.
• Determine auxiliary materials in advance.
• Conduct a brief pre-production meeting for each product to explain processes and quality expectations.
• Report test defects to directors and supervisors for intervention and specific plans.

III. Quality Control

• Conduct IPQC for the first SMT piece alongside production.
• Ensure quality and IPQC confirmation for testing and assembly.

IV. Current Process

All products undergo testing and burn-in. New Order process: SMT → Engineering trial first sample → DIP → Test → Assemble. Return Order process: SMT → DIP (Production trial first sample) → Test → Assemble.

V. New Process (Optimization)

• For return order production, conduct line burn-in and testing before DIP.
• Prepare all DIP first piece materials on the same day after SMT placement.

Efficient preparation is key to successful SMT chip processing manufacturing, ensuring timely completion and high-quality output.