1. Electroplated through-holes are essential features in printed circuit boards (PCBs), coated with a layer of copper to facilitate electrical conductivity. These holes serve as conduits, enabling circuits to traverse from one side of the board through the copper lining to the opposite side, crucial for PCB designs comprising multiple circuit layers.
2. During the PCB manufacturing process, the creation of plated through-holes involves drilling into the board laminate and the foil on both sides. Subsequently, the hole walls undergo electroplating to establish electrical connections between layers.
3. Prior to electroplating, the circuit board undergoes a preparatory step called copper deposition, where a chemically bonded, non-electroplated copper thin layer is applied throughout the circuit’s entirety, both within the hole and along the board’s edge.
4. Following deposition, the circuit pattern is applied and developed. Subsequently, the circuit’s designated areas receive a thicker copper layer through plating, ensuring the holes and circuits achieve the desired final thickness, typically around 0.001 inches (0.025mm). The manufacturing process proceeds until the board reaches completion.
5. Challenges during the deposition phase can lead to defects affecting the hole walls’ integrity, potentially resulting in PCB malfunction. A prevalent issue encountered is the formation of electroplating voids within the copper lining of the hole walls. Inadequate smoothness and incomplete coverage hinder the passage of current, as depicted in the accompanying image, showcasing insufficient copper deposition likely caused by poor plating practices.
6. Uneven copper coating during deposition is attributed to various factors such as contamination, air bubbles adhering to hole surfaces, or irregular drilling. These factors contribute to irregularities on the hole walls, impeding the application of a uniform copper layer, thus compromising conductivity.
7. To mitigate the occurrence of PCB plating voids arising from uneven drilling, adherence to manufacturer-recommended guidelines is imperative. Manufacturers typically specify the ideal drill bit types, numbers, and feed rates. Inadequate feed rates may result in material fracturing, leading to rough surfaces unsuitable for uniform coating during deposition and subsequent plating processes. Insufficient feed rates may also cause bit smearing, a correctable issue during decontamination procedures.
2. During the PCB manufacturing process, the creation of plated through-holes involves drilling into the board laminate and the foil on both sides. Subsequently, the hole walls undergo electroplating to establish electrical connections between layers.
3. Prior to electroplating, the circuit board undergoes a preparatory step called copper deposition, where a chemically bonded, non-electroplated copper thin layer is applied throughout the circuit’s entirety, both within the hole and along the board’s edge.
4. Following deposition, the circuit pattern is applied and developed. Subsequently, the circuit’s designated areas receive a thicker copper layer through plating, ensuring the holes and circuits achieve the desired final thickness, typically around 0.001 inches (0.025mm). The manufacturing process proceeds until the board reaches completion.
5. Challenges during the deposition phase can lead to defects affecting the hole walls’ integrity, potentially resulting in PCB malfunction. A prevalent issue encountered is the formation of electroplating voids within the copper lining of the hole walls. Inadequate smoothness and incomplete coverage hinder the passage of current, as depicted in the accompanying image, showcasing insufficient copper deposition likely caused by poor plating practices.
6. Uneven copper coating during deposition is attributed to various factors such as contamination, air bubbles adhering to hole surfaces, or irregular drilling. These factors contribute to irregularities on the hole walls, impeding the application of a uniform copper layer, thus compromising conductivity.
7. To mitigate the occurrence of PCB plating voids arising from uneven drilling, adherence to manufacturer-recommended guidelines is imperative. Manufacturers typically specify the ideal drill bit types, numbers, and feed rates. Inadequate feed rates may result in material fracturing, leading to rough surfaces unsuitable for uniform coating during deposition and subsequent plating processes. Insufficient feed rates may also cause bit smearing, a correctable issue during decontamination procedures.
