- Electroless Nickel-Gold Reaction Mechanism:
1.1 Nickel salt and reducing agent description
1.2 Mechanism of nickel plating
1.3 Chemical gold deposition mechanism - Control of Each Plating Process:
2.1 Pre-processing steps
2.2 Importance of degreasing
2.3 micro-etching considerations
2.4 Pickling for copper salts removal
2.5 Pre-activation and activation processes
2.6 Importance of thorough washing - Quality Challenges:
3.1 Difficulties and rework challenges
3.2 Importance of addressing quality issues from the source - Application of Electroless Nickel-Gold Plating:
4.1 Functional integration
4.2 Unique advantages and competition in the industry.
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
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