In the SMT chip processing industry, many micro-precision components are difficult to assess with the naked eye. For the safety and reliability of products, the IQC department will rigorously inspect incoming materials to prevent batch defects during production or in finished products. As part of SMT chip processing, it’s crucial to understand what constitutes IQC inspection defects and the specifics of IQC inspections. This article aims to clarify the contents of IQC inspections in SMT chip processing. We hope this information proves useful!
**Definition of Defects:** To effectively manage materials, it is essential to understand the definition of IQC incoming inspection defects within the SMT chip processing industry. This knowledge ensures that materials are assessed accurately, reasonably, and consistently.
1. **CR (Critical Defect):** Refers to a defect in a product that could potentially cause injury to the producer or user, lead to property damage, elicit customer complaints, or violate laws, regulations, and environmental standards. (Safety/Environmental Protection, etc.)
2. **MA (Material Defect):** Refers to a defect where a product’s specific feature fails to meet the required standards (structural or functional) or exhibits severe appearance defects.
**Definition of Defects:** To effectively manage materials, it is essential to understand the definition of IQC incoming inspection defects within the SMT chip processing industry. This knowledge ensures that materials are assessed accurately, reasonably, and consistently.
1. **CR (Critical Defect):** Refers to a defect in a product that could potentially cause injury to the producer or user, lead to property damage, elicit customer complaints, or violate laws, regulations, and environmental standards. (Safety/Environmental Protection, etc.)
2. **MA (Material Defect):** Refers to a defect where a product’s specific feature fails to meet the required standards (structural or functional) or exhibits severe appearance defects.
