2. SMT chip processing, circuit board proofing, and PCB board manufacturing are among our specialties.
3. Our circuit board factory is dedicated to guiding everyone through the PCB circuit board copying methods and proofing steps.
1. The first step of PCB proofing is obtaining a prototype. Initially, document the model, parameters, and positions of all critical components on paper, particularly noting the orientation of diodes, triode transistors, and IC gaps. It’s advisable to use a digital camera to capture two photos of these components’ locations.
2. The second step involves removing all components and desoldering the tin from the PAD holes. Clean the PCB with alcohol and proceed to scan it. Adjust the scanner to ensure higher pixel resolution for clearer images. Open Photoshop, scan the colored silk screen layer, save the file, and print it for reference.
3. In the third step of PCB proofing, lightly polish the TOP LAYER and BOTTOM LAYER with fine-grit sandpaper until the copper film shines. Scan each layer separately in color using Photoshop. Ensure the PCB lies flat in the scanner for accurate imaging; save the files appropriately.
4. Moving to the fourth step, adjust the canvas’s contrast and brightness to achieve strong differentiation between areas with and without copper film. Convert the second image to black and white to inspect the clarity of lines. Repeat adjustments if necessary; save the images as black and white BMP files: TOP.BMP and BOT.BMP. Use Photoshop for any necessary graphic repairs.
5. The fifth step entails converting the BMP files to PROTEL format, and importing both layers into PROTEL. Align the positions of PADS and VIAs on both layers; congruence indicates successful earlier steps. Rectify any deviations by revisiting the third step if needed.
6. In the sixth step, convert the TOP layer’s BMP file to TOP.PCB, ensuring conversion to the SILK layer (yellow layer). Trace the lines on the TOP layer and place components according to the second step’s diagram. Delete the SILK layer after completion.
7. For the seventh step, convert the BOT layer’s BMP file to BOT.PCB, paying attention to conversion to the SILK layer. Trace lines on the BOT layer and delete the SILK layer afterward.
8. The eighth step involves importing TOP.PCB and BOT.PCB into PROTEL and combining them into a unified image.
9. In the ninth and final step, use a laser printer to print the TOP LAYER and BOTTOM LAYER onto transparent film at a 1:1 ratio. Place the film over the PCB to verify alignment accuracy. If everything is correct, proceed accordingly.
Additional note: For multi-layer boards, meticulously polish the inner layers and repeat steps three to nine. Naming conventions for graphics vary based on the number of layers; generally, double-sided boards are simpler than multi-layer ones, which require extra caution due to potential alignment issues with internal vias and non-vias.
This revision aims to clarify each step and ensure procedural accuracy throughout the PCB proofing process.
