Product Details
The 10-layer HDI second-order PCB circuit board is developed and manufactured by QinLv International Co., Ltd. as part of its high-multilayer HDI series. This circuit board uses the EM285 high-quality material, with a line width and pitch of just 0.006/0.063mm, produced through laser drilling, surface gold plating, and other advanced processes.
The main technical features and challenges of this 10-layer HDI second-order PCB circuit board are its high-layer count and complexity, making it widely used in the mobile phone industry. The mobile phone PCB (Printed Circuit Board) plays a crucial role inside the phone, responsible for providing interconnections and support for the phone’s internal electronic components. Mobile phone PCBs usually need to meet the requirements of miniaturization, high density, and high reliability to accommodate the portable and multifunctional nature of smartphones.
Below are some of the main applications of mobile phone PCBs:
1. **Motherboard**
The mobile phone motherboard is the core of the phone. It integrates key electronic components such as the processor, memory, storage, power management chip, and baseband chip. The PCB on the motherboard is responsible for connecting these components together and facilitating communication with external interfaces.
2. **RF Board**
The RF board includes components related to wireless communication, such as antennas, power amplifiers, and filters. It connects to the motherboard through the PCB and is responsible for processing the transmission and reception of wireless signals.
3. **Operating System and Application Storage**
The mobile phone’s operating system and applications are typically stored in flash memory. This storage medium is connected to other components through the PCB, enabling data reading and writing.
4. **Power Management**
The battery and power management unit inside the phone are connected to the motherboard via the PCB, ensuring efficient and stable power supply.
5. **User Interface and Input/Output (IO)**
The phone’s screen, buttons, camera, and other sensors all need the PCB to enable data exchange and control with the main system.
6. **Expansion Interfaces**
Expansion interfaces, such as SIM card slots and MicroSD card slots, also require PCB connections to the phone’s internal circuits.
As smartphone technology continues to evolve, the design and manufacturing of mobile phone PCBs are also advancing to meet the demand for more advanced features and higher performance. For example, to achieve thinner phone designs, PCBs may use thinner materials and more compact routing, while higher-layer designs and more advanced packaging technologies may be employed to improve data processing capabilities. In conclusion, mobile phone PCBs play a key role inside the phone, and they are essential to the overall performance and reliability of the device.