Product material: Taiyao TU-872SLK,
Layers: 14 layers,
Board thickness: 1.60mm,
Surface treatment: gold immersion,
Line width/line spacing: 3/3 mil,
Minimum hole diameter: mechanical 0.15mm/laser 0.10mm,
Technical features: HDI six-stage arbitrary stages
14-layer HDI of any level
Product Details
The 6-layer interconnection HDI PCB blind/buried via board is one of the HDI series 6-layer circuit boards developed and produced by Qinlv Internation Co., Ltd.
This HDI blind/buried via board is manufactured using Taiyao TU-872SLK material, employing multiple laser drilling and lamination processes.
The minimum line width and spacing can reach 33 mil, and the minimum hole diameter can be as small as 0.1 mm.
This HDI blind/buried circuit board is widely used in digital cameras, laptops, mobile phones, and other electronic digital products, as well as in the automotive electronics field.