Number of layers: 14L
Board thickness: 3.0+/-0.2mm
Material: TU-872SLK
Thickness-to-diameter ratio: 3.8:1
Hole to line: 0.165mm Impedance tolerance: +/-5%
Product Details
The 14-layer through-hole high-speed material PCB is a multi-layer printed circuit board composed of 14 different circuit layers, designed to meet the signal transmission requirements in high-speed electronic devices. Through-hole via technology is widely used in this PCB to provide electrical connections between different layers. Through-holes are created by drilling holes in the PCB’s insulation layers and filling them with conductive materials like copper.
High-speed materials refer to those with specific electrical and thermal properties that can support high-speed signal transmission. These materials typically have characteristics such as low dielectric constant, low dielectric loss, good thermal conductivity, and dimensional stability. Choosing the right high-speed materials is critical for ensuring signal integrity, reducing signal delay, and minimizing signal loss in the PCB.
The key features of the 14-layer through-hole high-speed material PCB include:
– **High-density interconnection**: The 14-layer design provides a large number of interconnection paths, making it suitable for high-density packaging and complex electronic systems.
– **Through-hole technology**: Through-hole technology enables electrical connections between internal layers while maintaining the overall structural stability.
– **High-speed materials**: Specialized high-speed materials are used to ensure the speed and quality of signal transmission.
– **Signal integrity**: Design considerations such as impedance matching, ground noise, and power stability are essential to ensure the integrity and accuracy of signals.
– **Thermal management**: Multi-layer design helps distribute and manage heat, enhancing the stability and efficiency of electronic devices.
QinLv International Co., Ltd., as a professional PCB manufacturer, possesses the technical capability to produce 14-layer through-hole high-speed material PCBs. They understand the challenges of high-speed PCB design and have accumulated rich experience in material selection, design rules, and manufacturing processes. They can provide high-quality PCB products that meet customer needs. Whether for communication equipment, medical instruments, industrial control, or consumer electronics, QinLv International’s 14-layer through-hole high-speed material PCBs offer reliable solutions.
Board thickness: 3.0+/-0.2mm
Material: TU-872SLK
Thickness-to-diameter ratio: 3.8:1
Hole to line: 0.165mm Impedance tolerance: +/-5%
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