Product Details
1. Product Design Features
This 18-layer high-speed PCB features an innovative stacked structure design, optimized medium thickness and copper foil thickness to achieve excellent signal transmission speed and low latency. Key design points include:
– Signal layers are distributed across the 18 layers, with reasonable configuration of signal and power/ground layers to reduce signal crosstalk and improve overall EMC/EMI performance.
– Impedance control is achieved through precise control of line geometry and material selection, ensuring impedance control accuracy within 10%, maintaining signal integrity and stable transmission.
– Thermal design introduces efficient thermal channel design, optimizing heat distribution through flow paths and heat dissipation paths to improve thermal efficiency and reduce thermal resistance.
– Reliability analysis includes comprehensive stress analysis and failure mode assessment to ensure product reliability and durability in extreme environments.
2. Production Process Highlights
To meet the precision manufacturing requirements of high-speed PCBs, QinLv Internation Company adopts several advanced technologies in the production process:
– High-precision etching uses advanced etching techniques to achieve fine line etching with a minimum line width and spacing of 50μm.
– Layer alignment employs precise lamination processes and high-precision drilling technology to ensure inter-layer alignment accuracy of less than 25μm.
– Surface treatment offers various options such as gold, silver, and tin immersion to meet different application requirements and environments.
– Quality control is implemented throughout the entire production process with strict monitoring, including AOI, X-ray, and four-wire testing methods, ensuring the excellent quality of each PCB.
3. Performance Test Results
To verify the performance of the 18-layer high-speed PCB, Qinlv Internation Company conducted comprehensive testing, including but not limited to:
– Signal integrity testing, with oscilloscope results showing that the product supports data transmission speeds of up to 10Gbps.
– Thermal resistance testing, which shows that compared to traditional designs, the thermal channel design reduces the chip operating temperature by more than 20°C.
– Durability testing, with performance metrics remaining stable after 1000 hours of accelerated aging testing.
Wellcircuits Qinlv’s 18-layer high-speed PCB product achieves high performance, reliability, and excellent thermal management capabilities through fine design and strict manufacturing processes. This product is suitable for various high-end electronic devices, such as high-speed switches for data centers, high-performance computing platforms, and 5G communication devices. In the future, we will continue to delve into technological development to bring more innovative PCB solutions to the field.
