**Product Details**
The 18-layer high-speed backdrilled PCB (Printed Circuit Board) is one of the high-precision circuit boards developed and manufactured by QinLv International. It is designed to meet the strict requirements for signal transmission speed and signal integrity in high-speed electronic devices.

In high-speed PCBs, backdrilling technology is one of the key processes. It is used to optimize signal transmission performance, reduce signal loss and reflection, and ensure the stability and reliability of the circuit. Backdrilling mainly involves removing unnecessary conductor sections in the PCB, particularly the excess parts of vias. In multilayer PCBs, vias are typically used for electrical connections between different layers of the circuit. However, in high-speed signal transmission, the conductors at the top and bottom of the vias may cause signal reflection and loss, affecting signal quality. Through backdrilling, these conductors can be precisely removed, thus improving signal transmission characteristics.

The design and manufacturing of an 18-layer high-speed backdrilled PCB involve complex processes and highly precise equipment. Below are some key features of this type of PCB:
– **High-Density Interconnect (HDI):** With 18 circuit layers, this PCB can provide a large number of interconnection paths, making it suitable for high-density packaging and complex electronic system applications.

– **Strict Layer Alignment:** To ensure electrical performance and mechanical stability, the alignment between layers must be extremely precise.
– **Special Materials:** High-speed PCBs typically use special materials, such as low dielectric constant insulating materials, to reduce signal loss.
– **Thermal Management:** The multilayer design also enables thermal management, helping with heat dissipation and improving the stability of electronic devices.
– **Backdrilling Process:** The backdrilling process must be carefully controlled to avoid damaging the underlying layers while optimizing signal transmission.

QinLv International Co., Ltd., as a professional PCB manufacturer, has the capability to produce 18-layer high-speed backdrilled PCBs. The company employs the most advanced technology and equipment throughout the design, production, and testing processes to ensure product quality and performance. Whether for high-speed interconnection in data centers, high-performance computing (HPC) systems, or high-end consumer electronics, QinLv International’s high-speed backdrilled PCBs are the ideal choice.