Product material: FR-4 + PI material,
Number of layers: 4 layers, Board thickness: 1.20mm, Surface process: gold immersion, Line width/line spacing: 4/4 mil, Stack structure: 1 + 2 (FPC) + 1, Technical features: rigid-flex combination; HDI first stageHome » Shop » PCB Fabrication » 4-layer HDI first-level RF combination PCB