4-layer HDI first-level RF combination PCB

Product Details

SKU: 85a4839287ab Category: Tags: , , ,

Product material: FR-4 + PI material,

Number of layers: 4 layers,

Board thickness: 1.20mm,

Surface process: gold immersion,

Line width/line spacing: 4/4 mil,

Stack structure: 1 + 2 (FPC) + 1,

Technical features: rigid-flex combination; HDI first stage

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