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6-layer-rigid-flex-PCB

6 Layer HDI Rigid Flex PCB

This is a 6 layer rigid-flex circuit board for Optics device. The rigid flex PCB is widely used in  medical technology, sensors, mechatronics or in instrumentation, electronics squeezes ever more intelligence into ever smaller spaces, and the packing density increases to record levels again & again.

This HDI rigid flex PCB features Blind & Buried Holes, very thin 0.6mm rigid area thickness. It is an easy-to-make design, but with the help of advanced equipment and decades of manufacturing experience, we make this PCB successfully at one time and zero defect rate.

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6 Layer HDI RIGID-FLEX PCB W/ Blind Buried Vias

Product Description

This is a 6 layer HDI rigid flex PCB with blind & buried vias. Built up with most common rigid insulation material-FR4 and Dupont Polyimide, it has nice bending performance. Also its 0.6mm thick rigid area lends this board with good strength. All laminate material are from an authorized distributor under WellCircuit’s check.

 

By applying ENIG finish, this rigid flex circuit gets benefits like excellent surface planarity, good oxidation resistance, and suitability for movable contacts.

Layer 6L
Type
Rigid-Flex PCB
Material
Dupont PI & FR-4
Finish
ENIG
Features
Blind & buried vias
6layer-FPC-with-HDI
flexible-circuit
HDI-flex-circuits-cost
rigid-flex-pcb
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With HDI technology, its design flexibility, reliability, and routing efficiencies are noticeably improved. We drilled the blind & buried vias with CO2 to assure accuracy as via size is only 3mil. Not many chinese manufacturers can make HDI rigid flex PCB with high yield like Wellcircuits, below is the stack-up we make for this 6 layer HDI rigid flex PCB.

HDI Rigid-Flex PCB Stack-up

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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.

Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.

We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.

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