6-layer RF combination PCB

Product Details

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Product material: FR-4 + PI material,

 

Number of layers: 6 layers,

 

Board thickness: 1.00mm,

 

Line width/spacing: 6/6mil,

 

Surface process: immersion gold + gold plating,

 

Stacked structure: 2 + 2 (FPC) + 2,

 

Technical features: Rigid and Flex combination; gold-plated connectors; shielding film.

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