8-layer RF combination PCB

Product Details

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Product material: FR-4 + PI material,

Number of layers: 8 layers,

Board thickness: 1.60mm,

Surface process: Gold immersion,

Line width/line spacing: 3/3 mil,

Stack structure: 2+2 (FPC) + 2 (FPC) + 2,

Technical features: 2 pieces / 4-layer FPC lamination.

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