Layers : 4L
Thickness : 2.0mm
Out Layer Copper Thickness : 1 OZ
Inner Layer Copper Thickness : 1 OZ
Min hole size : 0.50mm
Min Line Width/Space : 5mil
Application :Base station sub board
Features : Large area of HASL process, with high flatness on Panel surface
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FPC & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production
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