Product Material: FR-4 TG150
Layer Count: 6 layers
Board Thickness: 1.20mm
Surface Finish: OSP (Organic Solderability Preservative)
Line Width/Spacing: 3/3 mil
Minimum Hole Size: Mechanical 0.15mm / Laser 0.10mm
Technical Features: Six-layer first-order P1.20mm high-density light board
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FPC & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production