HDI PCB Manufacturer China
High-Density Interconnects (HDI) PCBs, also known as Sequential Build-Up (SBU) or Build-Up Multilayer (BUM), are distinguished by their use of very small blind, buried, and through vias. These vias are created using methods beyond traditional mechanical drilling techniques.
The use of more complex components with very high input/output (I/O) counts has pushed the HDI board fabricator to enhance techniques for creating smaller vias, therefore many new or redeveloped processes appeared on the market.They all allow the designer to increase significantly routing density through the use of vias in surface-mount technology (SMT) pads, to reduce the size and weight of the product, and to improve the electrical performance of the system. These types of boards are generically called high-density interconnects (HDI). An HDI board typically will have, as on average, over 110 to 130 electrical connections per square inch (20 connections per sq. cm) on both sides of the board.
HDI PCB Manufacturing
We fabricate a variety of HDI PCB, including rigid HDI PCB, HDI flex PCB, or any PCB with microvia, stacked via, blind via, and buried via. Normally we start by building the prototype, then go to series production. Max layer for HDI PCB manufacturing is 20L.
Layer：6L 2 Tier
Thickness：1.3mm
Size：118.29mm*113.12mm
Min blind vias：0.1mm
Min buried vias：0.2mm
Min Trace：0.084mm
Min Space：0.089mm
Finish：ENIG+OSP
Layer：4L 1 Tier
Thickness：0.8mm
Size：70mm*86mm
Min Trace：0.12mm Min Space：0.075m
Min Hole Size：0.1m
Finish：ENIG+0SP
Application: Smart Watch
Layer：6L 2 Tier
Thickness：1.0mm
Size：92mm*118mm
Min Trace：0.075mm
Min Space：0.075mm
Min Hole：0.1mm
Finish：ENIG
Application: Mobile Phone
Layer：8L 2 Tier
Thickness：1.0mm
Size：118.29mm*113.12mm
Min blind vias：0.1mm
Min buried vias：0.2mm
Min Trace：0.084mm
Min Space：0.089mm
Finish：ENIG+OSP
Application: Car DVR
HDI PCB Advantage & Cost Benefits
Cost parity (for similar wiring densities) is achieved with a four-layer HDI microvia at approximately an eight-layer, through-hole printed circuit multilayer. At very high densities, there are no through-hole multilayers that can meet the wiring capacities and density demand necessary, whereas HDI can easily meet the requirements.
Get Instant Quote Now
Our Flexible Circuit Capability
Flexible Circuit's - Technical Capability
| Item: | Specification |
|---|---|
| Laminate Material: | FR-4, Polyimide, High Tg, Halogen free, High speed, High frequency |
| Layer: | 4-50 Layer |
| HDI Stackup: | 1+N+1, 2+N+2, 3+N+3,4+N+4, 5+N+5, Any Layer |
| Panel Size: | 21.5 X 24.5″(546mm X 622mm)” |
| Min Line Trace/Width: | 2mil/2mil |
| Min. Laser Drill Hole: | 3mil (0.075mm) |
| Finish: | HASL/Lead Free HASL, OSP, ENIG, Electro. Hard Gold, Electro-bondable Ni-Au,Electro-nickel palladium Ni-Au |
| Copper weights£¨finished): | 1/2 to 2 OZ |
| Min Annular Ring: | 2.5 mil |
| Min Dielectric Thickness: | 2mil |
WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FPC & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production
Get Instant Quote Now
HDI PCB Design Rules
Reviews
There are no reviews yet.