In terms of technology, the process flow of PCBA can be roughly divided into four main links, namely: SMT patch processing → DIP plug-in processing → PCBA testing → finished product assembly.

1、 SMT Assembly processing

SMT Assembly processing will generally match and purchase components according to the BOM allocation sheet provided by the customer, and confirm the PMC plan for production. After the preparation work is completed, start SMT programming, make laser steel mesh and solder paste printing according to the SMT process.
Mount the components on the circuit board through SMT mounting machine, and conduct online AOI automatic optical detection if necessary. After detection, set a perfect reflow furnace temperature curve to let the circuit board flow through reflow soldering.
After the necessary IPQC intermediate inspection, the DIP plug-in process can be used to pass the plug-in material through the circuit board and then through the wave soldering for welding. Next is the necessary post-furnace process.
After all the above processes are completed, QA shall conduct comprehensive inspection to ensure the product quality.

2、 DIP plug-in processing link
The process of DIP plug-in processing is: plug-in → wave soldering → leg cutting → post welding processing → plate washing → product inspection

3、 PCBA test
PCBA testing is the most critical quality control link in the whole PCBA processing process. It is necessary to strictly follow the PCBA testing standard and test the test points of the circuit board according to the customer’s test plan.
PCBA test also includes five main forms: ICT test, FCT test, aging test, fatigue test and test under harsh environment.

4、 Finished product assembly
The PCBA board that has been tested as OK is assembled into the shell, then tested, and finally shipped.
PCBA production is linked by one link. Any problem in any link will have a great impact on the overall quality, and each process needs to be strictly controlled.