Layers : 26L
Thickness : 6.6mm
Out Layer Copper Thickness : 2 OZ
Inner Layer Copper Thickness : 2 OZ
Min hole size :0.8mm
Min Line Width/Space : 3mil
Surface finish : Hard Gold
Application : IC testing instrument
Features : High complexity multilayer
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FPC & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production
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