High Frequency (HF) PCB Manufacturer
High Frequency PCB, short for HF PCB, is a type of PCB widely used in signal transmission applications, such as high-speed, microwave, 5G network, broadband, etc. It is available in the frequency range of 500MHz to 2GHz. An increasing number of automotive, industrial, military, homeland security, scientific, and medical applications are using RF technology to perform detection, measurement,and imaging functions.
High frequency PCB Example
| Item | Specs1 |
|---|---|
| Product: | High frequency PCB |
| Layer: | 10L |
| Thickness: | 2.0mm |
| Finish: | Immersion Silver |
| Highlight: | RO3003 + RO4450F + Isola 370HR Hybrid Build |
High frequency PCB Design
1. High Frequency PCB Stackup
In high frequency PCB design, “hybrid build” is often used to realize a balance between cost, reliability, and electrical performance. A hybrid construction could use a mix of FR-4 materials with high-frequency materials,or a mix of high-frequency materials with different dielectric constants, etc.
There are a few broad situations where you could consider using a hybrid stackup:
- Cost savings: Going all-PTFE or all-low-Dk materials is costly. The cost difference is not obvious at the prototyping stage, but it will add up greatly at series production.
- Low RF interconnect count: If all the high-speed/RF signals can be placed on one layer, it is a smart choice to use PTFE on a single circuit layer while the rest layers can be FR-4.
- mmWave designs: Some RF systems operating in the ISM band or 6-7 GHz WiFi will operate just fine on FR4-grade laminates as long as interconnects are short. Once you get to car radar frequencies or higher, you will generally need low-loss laminates unless your interconnects are very short as to be impractical.
1.2 10L Hybrid Stackup Example
The figure below shows an example of a hybrid stackup where R03003 PTFE high-performance materials are used only on the RF circuit layers while Isola 370HR Prepreg is used elsewhere.
2.High Frequency PCB Material
In high frequency PCB design, material selection is the foundation. Choosing the right laminate materials means a balance between cost and function performance. To ensure material is well selected, nothing can replace early communication with PCB fabricator to dive into particular laminates. Below are our available material :
| Stock Material for RF PCB | Tg | Td | Dk | Df | CTE-z (Pre-Tg) | Thermal Conductivity |
|---|---|---|---|---|---|---|
| Metric | °C | °C | @10GHz | @10GHz | ppm/°C | W/m*K |
| Rogers RO3003 ceramic-filled PTFE | – | 500° | 3 | 0.0013 | 25 | 0.5 |
Rogers RO4350B High Frequency Circuit | 280° | 390° | 3.5 | 0.0037 | 32 | 0.69 |
| Rogers RO4450F Bondply | >280° | 390° | 3.52 | 0.004 | 50 | 0.65 |
| RT-duroid | – | 500° | 2.2 | 0.0009 | 237 | 0.2 |
| I-Tera MT40 | 200° | 360° | 3.45 | 0.031 | 55 | 0.41 |
| Isola FR408HR | 180° | 360° | 3.67 | 0.012 | 60 | 0.4 |
| Isola I-Speed | 180° | 360° | 3.64 | 0.006 | 60 | 0.6 |
| Astra MT77 | 200° | 360° | 3 | 0.0017 | 50-70 | 0.45 |
High frequency PCB Capability
Today’s high frequency PCB manufacturers are much more available than ever. The task of finding the optimal manufacturer, reaching the perfect balance between cost and performance also becomes more challenging than ever. As one of the fast-growing high frequency PCB fabricators, we combine China’s cost advantages and PCB manufacturing technology advances to deliver cost-effective HF PCB production service.
| Item | Specs |
|---|---|
| Layers Count: | 2-20 |
| Laminate: | Rogers RO5880, RO5870, RO3003, RO4003C, RO4350B Arlon 25N/25FR, Taconic TLG, ISOLA MT40, ISOLA MT77 |
| Specialty | Controlled impedance, hybrid build, stacked microvias |
| Dielectric thickness | 0 .1mm-30mm |
| Copper weights（finished） | 1/2 to 2 OZ |
| Minimum track and space | 0.075mm/0.075mm |
| Maximum dimensions | 580mm x 1010mm |
| Surface Finishes | HASL, OSP, ENIG, Immersion Tin, Immersion silver |
| Back drilling | ≤16mil |
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