Rogers Corporation (NYSE:ROG) is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation, and other technologies where reliability is critical.
In high-frequency PCB production, Rogers laminate is the most popular choice by engineers owing to its low Dk/Low loss comes in various dielectric thicknesses.
Below are popular Roger laminate materials:
RT 5870 & 5880 Laminate
RT/duroid 5870 and 5880 laminates have a low dielectric constant (Dk) and low dielectric loss, making them well suited for high frequency/broadband applications. Helping to maintain the Dk uniformity are the randomly oriented microfibers reinforcing the PTFE composites.
Features
- Dk or 2.20 +/- .02
- Dissipation factor of .0009 at 10GHz
- Low moisture absorption
- Isotropic
RT 5870 & 5880 Laminate
RO4835 laminates are a low loss material that offer low cost circuit fabrication, compatible with standard epoxy/glass (FR-4) processes. These laminates are available with Rogers proprietary LoPro® Reverse treated copper foil, ideal for applications requiring low insertion loss.
Features
- RoHS compliant for applications requiring UL 94 V-0
- IPC-4103 compliant
- Dielectric constant (Dk) of 3.48 +/- .05
- Dissipation factor of 0.0037 at 10 GHz
- Isotropic
RO3000 Laminate
RO3000 Series laminates are circuit materials with consistent mechanical properties, regardless of the dielectric constant (Dk) selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering war-page or reliability problems. Additionally, the RO3000 series’ dielectric constant is stable over a wide temperature range.
Benefits
- Lowest loss commercial laminates
- Available in a wide range of Dk (3.0 to 10.2)
- Available both with and without woven glass reinforcements
- Low Z-axis CTE provides plated through-hole reliability
RT6202 Laminate
RT/duroid 6202 high frequency laminates offer electrical and mechanical properties essential in designing complex microwave structures that are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.
Features
- Dielectric constant (Dk) of 2.90 +/- .04
- Low dissipation factor of .0015 at 10GHz
- Low thermal coefficient of Dk at 5 ppm/°C
- Tight thickness control
Benefits
- Low loss for excellent high frequency performance
- Isotropic
TC600 Laminate
TC600 laminates best-in-class thermal conductivity and mechanical robustness enable printed circuit board (PCB) size reduction. The increased thermal conductivity provides higher power handling, reduces hot-spots and improves device reliability. Features
- Dielectric constant (Dk) of 6.15
- High thermal conductivity of 1.0W/mK
- Stable Dk across wide temperature range of -75ppm/°C from -40°C to 140°C
- Low loss tangent of .002 at 10 GHz
- Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C)
RT6035 Laminate
RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.
Features
- Dielectric constant of 3.50 +/- .05
- Dissipation factor of .0013 at 10GHz
- Thermal conductivity of 1.44 W/m/K at 80°C
- Thermally stable low profile and reverse treat copper foilTC600 Laminate
- Isotropic
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